2009
DOI: 10.1016/j.orgel.2009.06.012
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A novel low temperature integration of hybrid CMOS devices on flexible substrates

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Cited by 29 publications
(15 citation statements)
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“…Furthermore, the maximum processing temperature is maintained below 100°C, which is compatible with flexible substrates used in flexible electronic applications. 32 Normally, in devices with SiO 2 as the gate dielectric, the mobility increases linearly with increasing charge per unit area on the semiconductor side of the insulator ͑Q S ͒ and the gate field ͑E͒ until it eventually saturates. Because Q S is a function of the concentration of accumulated carriers in the channel region ͑N͒ and the accumulation region is confined very close to the interface of the insulator with the organic semiconductor, 33 an increase in gate voltage ͑V G ͒ results in an increase in E and N. Dimitrakopoulos and Malenfant demonstrated that high mobilities in pentacene TFTs can be achieved at low operating voltages when relatively high dielectric constant gate insulator materials are used.…”
mentioning
confidence: 99%
“…Furthermore, the maximum processing temperature is maintained below 100°C, which is compatible with flexible substrates used in flexible electronic applications. 32 Normally, in devices with SiO 2 as the gate dielectric, the mobility increases linearly with increasing charge per unit area on the semiconductor side of the insulator ͑Q S ͒ and the gate field ͑E͒ until it eventually saturates. Because Q S is a function of the concentration of accumulated carriers in the channel region ͑N͒ and the accumulation region is confined very close to the interface of the insulator with the organic semiconductor, 33 an increase in gate voltage ͑V G ͒ results in an increase in E and N. Dimitrakopoulos and Malenfant demonstrated that high mobilities in pentacene TFTs can be achieved at low operating voltages when relatively high dielectric constant gate insulator materials are used.…”
mentioning
confidence: 99%
“…Using a process previously reported by our group [41][42][43], bottom contact devices are fabricated on silicon nitride (Si 3 N 4 ) deposited on silicon wafers. Chromium (50 nm) was deposited by e-beam evaporation and then lithographically patterned and wet etched to form the gate electrode.…”
Section: Methodsmentioning
confidence: 99%
“…The performance of the resulting devices was evaluated and the DC electrical characteristics of the pentacene TFTs were measured in the air using a Keithley 4200 semiconductor characterization system. The detail discussion of the fabrication and measurement conditions of the transistors is given in [41][42][43].…”
Section: Methodsmentioning
confidence: 99%
“…Using a process previously reported by our group [23,24], bottom contact devices are fabricated on silicon nitride (Si 3 N 4 ) deposited on silicon wafers. Chromium (50 nm) was deposited by e-beam evaporation and then lithographically patterned and wet etched to form the gate electrode.…”
Section: Pentacene Tftmentioning
confidence: 99%