A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation

Abstract

With the development of miniaturization and integration of electronic devices, the conventional manifold microchannels (MMCs) structure has been unable to meet the heat dissipation requirements caused by the rapid growth of internal heat flux. There is an urgent need to design a new heat dissipation structure with higher heat dissipation capacity to ensure the working stability and life of electronic devices. In this paper, we designed a novel manifold dual-microchannel (MDMC) cooling system that embedded the microchannel structure into the manifold microchannel structure. The MDMC not only has good heat dissipation performance that can meet the development needs of electronic equipment to miniaturization and integration, but also has a compact structure that does not increase the overall thickness and volume compared with MMC. The high temperature uniformity and heat transfer performance of MDMC are significantly improved compared to MMC. The Tmax is reduced by 13.6% and 17.5% at the heat flux density of 300 W/cm2 and 700 W/cm2, respectively. In addition, the influence of the inlet−2 velocity and the total microchannels number on the heat transfer performance of the MDMC structure are numerically investigated. The results show that the decrease rate of Tmax and ΔT is about 6.69% and 16% with the increase of inlet−2 velocity from 1.2 m/s to 2.4 m/s and microchannels number from 10 to 48, respectively. At the same time, the best temperature uniformity is obtained when the number of microchannels is 16.

A Novel Swept-Back Fishnet-Embedded Microchannel Topology

“…The meshed model is then imported into Fluent for setup and solution. Before initializing the flow field and solving the calculations, the following simplifications and assumptions are made: the flow field is unidirectional, laminar, and incompressible; the physical properties of the fluid and solid heat sink are constant; the fluid flows at a constant rate with no slip against the fixed walls; and the solid–liquid interface meets the conditions of temperature uniformity, heat flow continuity, and no sliding boundary layers [ 2 , 5 , 29 , 30 ]. When using Fluent, the mesh quality of the model is first checked to ensure that the minimum volume of the mesh is greater than zero.…”

“…According to statistics, the reliability of the system will decrease by 50% when the temperature of the electronic devices increases by 10 °C. The cooling system can reduce electronic device temperature and maintain electrical performance stability, which has become an indispensable part of electronic device design [ 2 , 3 , 4 ]. The proposal and research of embedded cooling, i.e., direct cooling, has shifted the direction of chip cooling from traditional remote cooling to proximity cooling, i.e., the cooling mass is delivered directly into the chip substrate or adapter plate for cooling.…”

“…Because of the miniaturization of microelectronics technology, the development trend of high integration-making microelectronics devices work when the heat flux per unit area within the device increased significantly-is currently the main reason for the performance of the electronic devices to fail with declining appreciation. According to statistics, the reliability of the system will decrease by 50% when the temperature of the electronic devices increases by 10 • C. The cooling system can reduce electronic device temperature and maintain electrical performance stability, which has become an indispensable part of electronic device design [2][3][4]. The proposal and research of embedded cooling, i.e., direct cooling, has shifted the direction of chip cooling from traditional remote cooling to proximity cooling, i.e., the cooling mass is delivered directly into the chip substrate or adapter plate for cooling.…”