A Novel Meander Split Power/Ground Plane Reducing Crosstalk of Traces Crossing Over

Lee, Jung-Han

doi:10.3390/electronics8091041

Cited by 5 publications

(2 citation statements)

References 28 publications

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“…A power-ground plane is a large layer of copper foil which distributes the direct current (DC) power to active devices and acts as a voltage reference on a multilayer printed circuit board (PCB) [17]. Power-ground planes are also referred to as power distribution networks (PDNs) in PCB designs, as they provide a current path for power transmission from the source to the loads on the PCB.…”

Section: Power Ground Plane Modeling Using Dnnsmentioning

confidence: 99%

Power-Ground Plane Impedance Modeling Using Deep Neural Networks and an Adaptive Sampling Process

Goay,

Cheong,

Low

et al. 2022

International Journal of Electronics and Telecommunications

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This paper proposes a deep neural network (DNN) based method for the purpose of power-ground plane impedance modeling. A composite DNN model, which is a combination of two DNNs is used to predict the Z-parameters of power ground planes from their design parameters. The first DNN predicts the normalized Z-parameters whereas the second DNN predicts the original maximum and minimum values of the nonnormalized Z-parameters. This allows the method to retain a high accuracy when predicting responses that have large variations across designs, as is the case with the Z-parameters of the power-ground planes. We use the adaptive sampling algorithm to generate the training and validation samples for the DNNs. The adaptive sampling algorithm starts with only a few samples, then slowly generates more samples in the non-linear regions within the design parameters space. The level of non-linearity of the regions is determined by a surrogate model which is also trained using the generated samples as well. If the surrogate model has poor prediction accuracy in a region, then the adaptive sampling algorithm will generate more samples in that region. A shallow neural network is used as the surrogate model for non-linearity determination of the regions since it is faster to train and update. Once all the samples have been generated, they will be used to train and validate the composite DNN models. Finally, we present two examples, a square-shaped power ground plane and a squareshaped power ground plane with a hollow square at the center to demonstrate the robustness of the DNN composite models.

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Section: Power Ground Plane Modeling Using Dnnsmentioning

confidence: 99%

Power-Ground Plane Impedance Modeling Using Deep Neural Networks and an Adaptive Sampling Process

Goay,

Cheong,

Low

et al. 2022

International Journal of Electronics and Telecommunications

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“…The bonding wire process of Bonding Wire reduces the via holes, shortens the leads, enhances the impedance continuity of the signal transmission line and then reduces reflection. The chip is bonded to the leads with tightly coupled differential pair leads to reduce crosstalk [22]. The signal integrity of SiP is improved compared to traditional PCB, especially DDR3-related signals.…”

Section: Ddr3 Memory Test Comparison and Analysismentioning

confidence: 99%

Design and Realization of an Aviation Computer Micro System Based on SiP

Zhang

Wei

et al. 2020

Electronics

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In recent years, microelectronics technology has entered the era of nanoelectronics/integrated microsystems. System in Package (SiP) and System on Chip (SoC) are two important technical approaches for microsystems. The development of micro-system technology has made it possible to miniaturize airborne and missile-borne electronic equipment. This paper introduces the design and implementation of an aerospace miniaturized computer system. The SiP chip uses Xilinx Zynq® SoC (2ARM® + FPGA), FLASH memory and DDR3 memory as the main components, and integrates with SiP high-density system packaging technology. The chip has the advantages of small size and ultra-low power consumption compared with the traditional PCB circuit design. A pure software-based DDR3 signal eye diagram test method is used to verify the improvement inf the signal integrity of the chip without the need for probe measurement. The method of increasing the thermal conductive silver glue was used to improve the thermal performance after the test and analysis. The SiP chip was tested and analyzed with other mainstream aviation computers using a heading measurement of extended Kalman filter (EKF) algorithm. The paper has certain reference value and research significance in the miniaturization of the aviation computer system, the heat dissipation technology of SiP chip and the test method of signal integrity.

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Crosstalk Prediction In Integrated Circuits Based on Machine Learning Techniques

Abgaryan

2023

2023 IEEE East-West Design &Amp; Test Symposium (EWDTS)

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A Novel Meander Split Power/Ground Plane Reducing Crosstalk of Traces Crossing Over

Cited by 5 publications

References 28 publications

Power-Ground Plane Impedance Modeling Using Deep Neural Networks and an Adaptive Sampling Process

Power-Ground Plane Impedance Modeling Using Deep Neural Networks and an Adaptive Sampling Process

Design and Realization of an Aviation Computer Micro System Based on SiP

Crosstalk Prediction In Integrated Circuits Based on Machine Learning Techniques

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