Here, a new design of a variable micro electromechanical system (MEMS) capacitor is introduced to use in telecommunication systems. For the first time, an on-chip MEMS component has been used in the substrate integrated waveguide (SIW) structures to avoid discrete and non-integrated connection problems and high noise levels and affects the operating frequency of telecommunication systems. The behaviour of two capacitors with the fixed-fixed and supported membrane by special spiral arms is analysed and simulated using the finite element method. The MEMS bridges are implemented by a 6 μm gold layer and an air gap of 3 μm. It can be seen that using the new special arms, the movement of the membrane is more uniform than the clamped while the actuation voltage is up to 1.32 V and the tuning range of the capacitor is 29%. Then both the capacitors are placed on half-mode SIW structure and the electromagnetic simulation is done. Finally, the results comparison shows that the frequency tuning range of the MEMS variable capacitor is more significant than the other.