A novel method for measuring viscoelastic parameters of epoxy resins under water bath environments using embedded strain gauges

Shi, Xinghua; Qiu, Yuanying; Jia, Fei; Ma, Hongbo

doi:10.1016/j.polymertesting.2022.107847

Cited by 2 publications

(1 citation statement)

References 27 publications

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“…39,40 The absorption of moisture by the resin leads to swelling, wherein various components within the packaging materials exhibit different swelling tendencies, and this divergence generates hygroscopic stress, impacting the material's longevity. 41,42 Moreover, the presence of water molecules, being polar, can influence the dielectric properties of the material. 43 Figure 7c illustrates the variation in the water absorption by the resin.…”

Section: Coefficient Of Thermal Expansion (Cte)mentioning

confidence: 99%

Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins

Liu,

Qin,

Cui

et al. 2024

Ind. Eng. Chem. Res.

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Cycloaliphatic epoxy resins are known for their synthesis process that eliminates hydrolyzable chlorine, thus avoiding the hydrolysis of hydrolyzable chlorine to hydroxyl groups in conventional epoxies, which is very favorable for the preparation of low dielectric epoxy resins. The curing process using active ester generates no hydroxyl groups, also indicating a promising approach for producing low dielectric epoxy resins. However, the resistance of cycloaliphatic epoxy to nucleophilic reactions restricts it from reacting usually only with anhydrides. This study investigates the reactivity of the active ester with cycloaliphatic epoxy, demonstrating its capability to undergo complete curing reactions at temperatures near 150 °C. Factors influencing this process, including the volatilization of the catalyst DMAP and its reactivity, are examined. Two types of cycloaliphatic epoxies (3,4-epoxycyclohexylmethyl-3′,4'-epoxycyclohexane carboxylate (EEC) and bis (3,4-epoxycyclohexylmethyl) adipate (BEA)) are combined with an active ester hardener, triacetyl resveratrol (TAR), to prepare epoxy resins. The activation energies for the curing reactions are determined, and the optimal concentration of catalyst 4-dimethylaminopyridine (DMAP) is identified for each resin. The use of catalysts at specific concentrations results in resins with superior mechanical properties (91.7 and 71.4 MPa for EEC/TAR and BEA/TAR), excellent thermal stability (T d5% of 354 and 347 °C), and good dielectric properties (dielectric constant of 3.68 and 3.95 at 10 MHz), outperforming anhydride-cured cycloaliphatic epoxy resins. These findings expand the selection of hardeners for cycloaliphatic epoxy resins and highlight the potential of the prepared resins in electronic packaging materials, offering enhanced properties suitable for various applications.

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Section: Coefficient Of Thermal Expansion (Cte)mentioning

confidence: 99%

Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins

Liu,

Qin,

Cui

et al. 2024

Ind. Eng. Chem. Res.

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Preparation and performance comparison of low‐dielectric epoxy resins cured by naphthalene‐ and phenyl‐based active esters

Zhu,

Liu,

Qin

et al. 2024

J of Applied Polymer Sci

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The poor dielectric properties of epoxy resins limit their application in microelectronics, and active ester curing agent is an effective means to enhance the dielectric properties of epoxy resins. However, the phenyl active ester curing resins nowadays have the problem of low mechanical properties. In this work, a novel naphthalene‐based active ester‐cured resveratrol epoxy resin system (REP/NDA) was prepared for the first time. Compared with the phenyl‐active ester‐cured epoxy resin (REP/PDA), the naphthyl‐active ester prepared epoxy resin has obvious advantages in mechanical properties. The experimental results indicated a tensile strength measurement for REP/NDA at 91.9 MPa, the tensile strength of REP/PDA was 65.3 MPa, and the tensile strength of REP/NDA was 141% of that of REP/PDA. The prepared REP/NDA epoxy resin exhibits favorable dielectric properties, evidenced by a dielectric constant of 3.02 at 10 MHz and a dielectric loss of 0.0042, very good thermal stability (T5% of 379°C), excellent water absorption (only 0.49% for 7 days from 2 to 8°C) and good dimensional stability (coefficient of thermal expansion below Tg of 77 ppm). The first synthesis of naphthalene‐based active ester curing agent offers a reference for creating new low dielectric epoxy resin materials that work out exceptionally.

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A novel method for measuring viscoelastic parameters of epoxy resins under water bath environments using embedded strain gauges

Cited by 2 publications

References 27 publications

Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins

Curing Behavior and Properties of Active Ester Cured Cycloaliphatic Epoxy Resins

Preparation and performance comparison of low‐dielectric epoxy resins cured by naphthalene‐ and phenyl‐based active esters

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