A novel Model for the Mechanism of Laser-Induced Back Side Wet Etching in Aqueous Cu Solutions using ns Pulses at 1064 nm

Influence of the pre-treatment of glass substrates on Laser-Induced Backside Wet Etching using NIR Nanosecond-Pulses and Cu-based solutions

“…In addition the average ablation rate for the silanized surface are lower for low iteration numbers because the number of adsorption sites for Cu 2+ is reduced due to the silanization. As discussed in the introductory chapter and in [7], this behavior is consistent with a partial blocking of the Cu 2+ absorption sites by the CH 3 -groups on the silanized surface. Once all silanized sites with the CH 3 -groups are removed the average ablation rate values for the silanized surface reach the values as measured from the untreated surface.…”

“…Our experiments (see [7] and this work) show that if the adsorption sites (or large parts of the adsorption sites) are blocked by CH 3 -groups due to the silanization treatment (see Figure 2b), the ablation onset is delayed. This corroborates the ablation model described above.…”

“…The desired structures are achieved by irradiating through a mask [6]. In recent work [7,8] we have demonstrated that LIBWE is also working using ns laser pulses at 1064 nm wavelength and Cu-based absorber solutions. This specific LIBWE setup could be interesting especially for industrial applications because NIR-ns-laser systems are widely used and also affordable.…”

“…As discussed in [7] it is assumed that for CuSO 4 in aqueous solution (also referred to as CuSO 4 in the following) the ablation at the surface of the transparent substrate takes place due to adsorbed Cu 2+ species that are present in the solution (see Figure 2a). The adsorption of Cu 2+ at the untreated surface is likely because this modification of the soda lime substrate has a polar surface.…”

Laser-induced chemical liquid-phase deposition of copper on transparent substrates

“…LCLD is a wellknown technique and is applied for a long time already [1][2][3][4][5][6][7][8][9]. In recent work, our group investigated an ablation technique called laser induced backside wet etching (LIBWE) [10,11]. This technique allows smooth and controlled ablation of transparent materials using related setup components like LCLD and also related CuSO 4based solutions as absorber liquids.…”