A novel multilayer circuit process using YBa2Cu3O<i>x</i>/SrTiO3 thin films patterned by wet etching and ion milling

Li, H. Q.; Ono, Ronald H.; Vale, Leila R.; Rudman, D. A.; Liou, Sy‐Hwang

doi:10.1063/1.117700

Cited by 10 publications

(3 citation statements)

References 10 publications

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“…6,7 Our experiments allowed us to investigate the propagation of grain boundaries in a multilayer structure. This is an important material science issue itself because many practical devices require multilayer circuits consisting of crossovers, via connections, 8,9 and stacked superconducting paths over bicrystal grain boundaries. Bicrystal Josephson junctions are promising in device applications such as superconducting quantum interference devices ͑SQUIDs͒ 10 and voltage standards.…”

Section: ͓S0003-6951͑97͒00534-2͔mentioning

confidence: 99%

High temperature superconducting Josephson junctions in a stacked bicrystal geometry

Ono

Vale

et al. 1997

Applied Physics Letters

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Bicrystal grain boundary Josephson junctions were fabricated in a stack of two layers of YBa2Cu3Ox separated by epitaxial SrTiO3. Weak link behavior was observed in the bridges formed in both layers that had similar shunted-junction characteristics but significantly different critical currents. Characteristic voltages up to 1.9 mV were measured at 4.5 K. The resonant structure was seen in the current–voltage characteristics of the upper-layer junctions, and interactions between junctions in the two layers were evident.

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Section: ͓S0003-6951͑97͒00534-2͔mentioning

confidence: 99%

High temperature superconducting Josephson junctions in a stacked bicrystal geometry

Ono

Vale

et al. 1997

Applied Physics Letters

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“…The processing of YBCO thin films as Josephson junctions and SQUIDs, constructed vertically on a substrate, has been reserving an important place in the multilayer fabrication [1][2][3][4][5][6]. There is a demand for multilayer fabrication for the purpose of reducing the noise problems and improving the sensitivity of these devices [7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Developing a trilayer processing technique for superconducting Y Ba₂Cu₃O_7−δthin films by using Ge ion implantation

Avci¹,

Tepe²,

Öktem³

et al. 2005

Supercond. Sci. Technol.

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For making trilayer superconducting devices based on YBa 2 Cu 3 O 7−δ (YBCO) thin film processing, we developed a new technique by employing Ge ion implantation. A YBCO thin film of 150 nm thickness having high c-axis orientation and a transition temperature, T c , of 90 K was implanted with 80 keV, 1 × 10 16 Ge ions cm −2 at room temperature. By the result of TRIM calculation, Ge ions were found to penetrate into the YBCO thin film approximately 60 nm below the surface of the film, thus leaving the lower part of the film as a superconductor. Upon implantation with Ge ions, the implanted upper part of the sample lost its electrical conductivity and diamagnetism while its original crystalline structure was preserved. The implanted ions we found did not alter the overall crystal structure of the YBCO thin film; this allowed us to grow an epitaxial superconducting upper layer of YBCO on top of the implanted area, leaving no need to use any buffer layer. The superconducting properties of the upper layer were similar to those of the pure YBCO base layer with an increased room temperature resistivity and a lowered T c (88 K). This process provides an effective method for fabrication of a trilayer HTS device structure.

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“…As approach to the problem, several groups used a modified ion beam etching process @E) [2]- [3]. Other approaches are a microshadow mask technique to form a film with smooth and gentle slope on edges in-situ [4], a process combining wet etching process using hydrofluoric acid and Ar ion milling [5], and complementary mask planarization [6]. We have introduced Chemical Mechanical Planarization (CMP) into the multilayer Manuscript recieved September 14, 1998 fabrication process in order to improve the superconducting and insulation properties.…”

Section: Introductionmentioning

confidence: 99%

Improvement of SrTiO/sub 3/ thin film surface polished by chemical mechanical planarization for HTS multilayer device

Takashima¹,

Terada²,

Koyanagi³

1999

IEEE Trans. Appl. Supercond.

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In order to improve the superconducting and insulation properties of the HTS multilayer structure, .we have introduced Chemical Mechanical Planarization (CMP) into the fabrication process. While the surface roughness of the upper SrTiO,(STO) film due to the precipitates on the base YBa,Cu,O, (YBCO) film was decreased less than 1/10 by CMP and those of the edge angle of the patterned base films was reduced from 90 t o less than 1 degree, the as-polished surface crystallinity was amorphous as observed by RHEED. For improvement of the crystallinity, the surface was annealed to show pattern with clear streaky spots. The top YBCO stripline in the crossover structures had a T, of 89 K and J, of more than 1.0 X 1O6A/cm2 ,at 77 K. The insulation resistivity between two YBCO layers at 77 K was 7 X 1 0 8 Q c m .

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A novel multilayer circuit process using YBa2Cu3Ox/SrTiO3 thin films patterned by wet etching and ion milling

Cited by 10 publications

References 10 publications

High temperature superconducting Josephson junctions in a stacked bicrystal geometry

High temperature superconducting Josephson junctions in a stacked bicrystal geometry

Developing a trilayer processing technique for superconducting Y Ba₂Cu₃O_7−δthin films by using Ge ion implantation

Improvement of SrTiO/sub 3/ thin film surface polished by chemical mechanical planarization for HTS multilayer device

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A novel multilayer circuit process using YBa2Cu3Ox/SrTiO3 thin films patterned by wet etching and ion milling

Cited by 10 publications

References 10 publications

High temperature superconducting Josephson junctions in a stacked bicrystal geometry

High temperature superconducting Josephson junctions in a stacked bicrystal geometry

Developing a trilayer processing technique for superconducting Y Ba2Cu3O7−δthin films by using Ge ion implantation

Improvement of SrTiO/sub 3/ thin film surface polished by chemical mechanical planarization for HTS multilayer device

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Developing a trilayer processing technique for superconducting Y Ba₂Cu₃O_7−δthin films by using Ge ion implantation