A novel multiple-axis MEMS gyroscope-accelerometer with decoupling frames

Baranov, Pavel; Nesterenko, Tamara G.; Barbin, Evgenii; Koleda, A N; Tanaka, Shuji; Tsukamoto, Takashiro; Kulinich, Ivan V.; Zykov, D. D.; Shelupanov, Alexander

doi:10.1108/sr-05-2018-0133

Cited by 9 publications

(3 citation statements)

References 19 publications

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“…Microstructures based on silicon substrates are, therefore, a key issue in bulk micromachining technology. Bulk Si three-dimensional (3D) micromachined structures (e.g., cavities, grooves, through holes, and mesas) have been an area of extensive research in microelectromechanical systems (MEMS) [1][2][3][4]. From the fabrication point of view, etching techniques are divided into two main categories: deep reactive ion etching (DRIE) and anisotropy wet etching.…”

Section: Introductionmentioning

confidence: 99%

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Wang

2020

Micromachines

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To create approximately spherical structures with curved sidewalls, this paper presents a method for building a series of decreasing slopes along the sidewall of a circular truncated cone. The multistep ring-edge etching technology of first reducing the concentric mask and then cutting the top off to create a mesa shape can be used to form the slopes. This wet-etching method avoids the constraints of crystallographic properties with surfactant-added Tetramethylammonium hydroxide (TMAH), enabling the manufacture of successive given inclination angles, the precise modulation of the spherical curvature by reduction design of concentric masks, and the setting of etching time. The newly approximated spherical Si microstructure patterns can be used for microlenses, quartz crystal resonators, micropulleys, and other applications. The present research is an approach to fabricate advanced microelectromechanical systems (MEMS) curved-surface structures, extending the range of 3D structures fabricated by silicon wet etching.

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Section: Introductionmentioning

confidence: 99%

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Wang

2020

Micromachines

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“…The bonding temperature is 320°C. The whole flow process is described in more detail in Baranov et al (2019). The manufactured test ESs are shown in Figure 24.…”

Section: Resultsmentioning

confidence: 99%

Constructive approach to reduce the influence of temperature on spring suspension eigenfrequencies

Baranov

Nesterenko

Barbin

et al. 2020

Self Cite

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Purpose One of the problems encountered by developers of inertial systems, such as gyroscopes and accelerometers, is the critical dependence of the eigenfrequencies of elastic suspensions (ES) on temperature when using substrates for sensors made of dielectric materials, such as borosilicate glass. The internal stresses arising in the ES caused by the difference in the temperature coefficients of linear expansion (TCLE) lead to deformation of the sensor and complication of the electronic part of the sensor. The purpose of this paper is to approach for in-plane and out-of-plane ES are considered that allow for minimization of the influence of internal stresses on eigenfrequencies. Design/methodology/approach Analytical, finite element and experimental results are considered. The temperature coefficient of thermal expansion, the Young’s modulus and the Poisson ratio are given as a function of temperature. The shape of the spring elements (SEs) and the construction of the elastic suspension are the main topics of focus in this study. The authors’ out-of-plane ES based on a meander-like spring element implemented via finite element modeling show good agreement with the experimental results. Findings Meander-like SEs have been developed that have lower temperature errors in comparison with traditional types of SEs. The main contribution to the change in the eigenfrequency from temperature is made by internal stresses that arose from the deformation of the bonded materials with different TCLE. The change of eigenfrequency from the temperatures that were calculated by finite element method did not exceed 0.15%, however, in practice, the scatter of the obtained characteristics for different samples showed a change of up to 0.3%. Originality/value This study shows a way to design and optimize the structure and theoretical background for the development of the microelectromechanical systems (MEMS) inertial module combining the functions of gyroscope and accelerometer. The obtained results will improve and expand the manufacturing technology of MEMS gyroscopes and accelerometers.

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“…In addition, fields such as navigation [ 2 ], consumer electronics [ 3 ], flight vehicles [ 4 ], and biomechanics [ 5 ] also require the simultaneous measurement of the six spatial components of the acceleration. At present, most of the fields mentioned above use inertial measurement units (IMUs) to measure the space six-axis accelerations of an object, that is, a combined measurement scheme of three linear accelerations and three gyroscopes [ 6 , 7 ]. In general, low-cost IMUs are often limited by gyroscope defects, such as large size, high cost, and large bias instability.…”

Section: Introductionmentioning

confidence: 99%

Forward and Inverse Dynamics of a Six-Axis Accelerometer Based on a Parallel Mechanism

Wang

You

Yang

et al. 2021

Sensors

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The solution of the dynamic equations of the six-axis accelerometer is a prerequisite for sensor calibration, structural optimization, and practical application. However, the forward dynamic equations (FDEs) and inverse dynamic equations (IDEs) of this type of system have not been completely solved due to the strongly nonlinear coupling relationship between the inputs and outputs. This article presents a comprehensive study of the FDEs and IDEs of the six-axis accelerometer based on a parallel mechanism. Firstly, two sets of dynamic equations of the sensor are constructed based on the Newton–Euler method in the configuration space. Secondly, based on the analytical solution of the sensor branch chain length, the coordination equation between the output signals of the branch chain is constructed. The FDEs of the sensor are established by combining the coordination equations and two sets of dynamic equations. Furthermore, by introducing generalized momentum and Hamiltonian function and using Legendre transformation, the vibration differential equations (VDEs) of the sensor are derived. The VDEs and Newton–Euler equations constitute the IDEs of the system. Finally, the explicit recursive algorithm for solving the quaternion in the equation is given in the phase space. Then the IDEs are solved by substituting the quaternion into the dynamic equations in the configuration space. The predicted numerical results of the established FDEs and IDEs are verified by comparing with virtual and actual experimental data. The actual experiment shows that the relative errors of the FDEs and the IDEs constructed in this article are 2.21% and 7.65%, respectively. This research provides a new strategy for further improving the practicability of the six-axis accelerometer.

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A novel multiple-axis MEMS gyroscope-accelerometer with decoupling frames

Cited by 9 publications

References 19 publications

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

Constructive approach to reduce the influence of temperature on spring suspension eigenfrequencies

Forward and Inverse Dynamics of a Six-Axis Accelerometer Based on a Parallel Mechanism

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