Abstract:We introduce a new lift-off technique, which, compared to the conventional lift-off process, has both high yield (>90%) and high reproducibility (>95%). It has been shown that by etching after pattern transfer and prior to material deposition, the adhesion of the deposited material to the substrate is improved and roughness of feature edges is eliminated. This procedure is tailored to meet fabrication reproducibility criteria for nanoscale as well as microscale features.
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