2019
DOI: 10.11591/ijece.v9i5.pp4027-4034
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A novel optimization framework for controlling stabilization issue in design principle of FinFET based SRAM

Abstract: The conventional design principle of the finFET offers various constraints that act as an impediment towards improving ther performance of finFET SRAM. After reviewing existing approaches, it has been found that there are not enough work found to be emphasizing on cost-effective optimization by addressing the stability problems in finFET design.Therefore, the proposed system introduces a novel optimization mechanism considering some essential design attributes e.g. area, thickness of fin, and number of compone… Show more

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Cited by 2 publications
(1 citation statement)
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“…In order to meet these needs, new process technologies have emerged, such as sub-micron processes, multi-layer metal interconnects, and so on. Since 2000, with the popularity of mobile communication and smartphones, chip manufacturing process has entered the nanoscale period and sub-nanoscale technologies such as FinFET(fin field effect)structures have been introduced to further improve chip performance and power efficiency [2]. Today's chip manufacturing process continues to move deeper into the nanoscale, and involves more innovative technologies and materials such as 3D integrated circuits, gallium nitride, silicon-based photonics and other fields that continue to evolve to meet the requirements of emerging applications such as artificial intelligence, the Internet of Things and 5G.…”
Section: Development Historymentioning
confidence: 99%
“…In order to meet these needs, new process technologies have emerged, such as sub-micron processes, multi-layer metal interconnects, and so on. Since 2000, with the popularity of mobile communication and smartphones, chip manufacturing process has entered the nanoscale period and sub-nanoscale technologies such as FinFET(fin field effect)structures have been introduced to further improve chip performance and power efficiency [2]. Today's chip manufacturing process continues to move deeper into the nanoscale, and involves more innovative technologies and materials such as 3D integrated circuits, gallium nitride, silicon-based photonics and other fields that continue to evolve to meet the requirements of emerging applications such as artificial intelligence, the Internet of Things and 5G.…”
Section: Development Historymentioning
confidence: 99%