A novel package approach for multichip modules based on anisotropic conductive adhesives

Heyen, Johann; Jacob, Arne F.

doi:10.1109/eumc.2005.1610235

Cited by 4 publications

(1 citation statement)

References 10 publications

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“…The current issue and full text archive of this journal is available on Emerald Insight at: https://www.emerald.com/insight/1356-5362.htm is only widely used in the radio frequency identification, tag assembly (Cai et al, 2013) and other few applications. But in recent years, some had tried to apply ACP in the sensor packaging (Karasawa et al, 2001), chips and embedded interconnection assembly (Chang et al, 2005), surface mount application (Lin et al, 2013), multichip modules interconnection and packaging (Heyen and Jacob, 2005) and so on. It has the advantages of lower cost than ACF, better stability after bonding (Chang et al, 2009) and reflux resistance process (Karasawa et al, 2001).…”

Section: Introductionmentioning

confidence: 99%

The preparation of anisotropic conductive paste and its application in FOB interconnection

Cai

Zhai²,

Zhou³

et al. 2023

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Purpose The purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by dispersing nickel balls in the epoxy-curing system. Design/methodology/approach Differential scanning calorimetry was used to evaluate the curing characteristics of the paste. And the contact resistances of bonding joints and 90º peel adhesion were tested before and after high temperature and high humidity test (85°C, 85% humidity), thermal cycling (−45°C∼125°C, 30min/cycle) and pressure cooker test (PCT, 121°C, 100% humidity 2 atm) to evaluate the flex on board (FOB) interconnection reliability. Findings It is found that FOB test vehicles have been successfully bonded by using ACP for the first time. And the ACP bonding joint of FOB has good reliability and can meet the requirements of FOB interconnection. Compared with conventional anisotropic conductive film (ACF), this ACP interconnection provides higher adhesion strength, higher joint current carrying capability and higher reliability performance and lower cost for FOB interconnection. Originality/value ACP is applied in the interconnection of FOB. It has the higher reliability performance and lower cost for than the conventional ACF.

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