A Novel Photosensitive Polyimide: A Polyimide Containing the Hydroxytriphenylamine Structure with Diazonaphthoquinone

Abstract

A novel photosensitive polyimide based on a polyimide containing the hydroxytriphenylamine structure (HTA-PI) and 2, 3, 4-tris[1-oxo-2-diazonaphthoquinone-4-sulfonyloxy] benzophenone (D4SB) as a photoreactive compound has been developed. The HTAPI was prepared by the ring-opening polyaddition of 4, 4′-hexafluoroisopropylidenebis(phthalic anhydride) (6FDA) and 4,4′-diamino-4″-hydroxytriphenylamine (DHTA), followed by thermal cyclization in refluxing N-methyl-2-pyrrolidone (NMP). The resulting polyimide film showed excellent transparency to 436 nm light. Photosensitive polyimide containing 30 wt% of D4SB showed a sensitivity of 800 mJ cm−2 and a contrast of 0.8 when it was exposed to 436 nm light followed by development with 5% tetramethylammonium hydroxide (TMAH) aqueous solution at 45°C.

Asymmetric-based novel poly(ether-imide)s: Preparation, properties, kinetics of thermal decomposition, and study electrochemical oxidation behavior by using nanocomposite paste of polymer and multi-walled carbon nanotube

“…Proton and carbon nuclear magnetic resonance ( 1 H-NMR and 13 C-NMR) spectra were recorded on a 500 MHz…”

“…These structural modifications include insertion of flexible linkages on the main chain, [6][7][8] use of noncoplanar 9 or asymmetric monomers 10 and incorporation of pendent groups in the polymer backbone. [11][12][13] Generally, introducing bulky pendants and heteroaromatic rings into polyimides chains has been considered to be an efficient method to provide not only enhanced solubility but also good thermal and thermooxidative stability. [14][15][16] The rigidity based on the symmetry and aromaticity of the heteroaromatic rings contributes to the thermal stability, chemical stability and retention of mechanical properties of the resulting polymer at elevated temperatures.…”

A novel positive‐type photosensitive polyimide based on soluble block copolyimide showing low dielectric constant with a low‐temperature curing process

“…Patterning has to be carried out with the use of industrially standardized tetramethylammonium hydroxide (TMAH) photoresist developer. Several attempts to synthesize TMAH‐developable positive PSPIs in combination with o ‐diazonaphthoquinone (DNQ) have been reported 9–12…”

Novel Low-Dielectric Constant Photodefinable Polyimides for Low-Temperature Polymer Processing

“…There are generally two approaches to producing photosensitive polyimide compositions: (1) formulations based on the use of poly(amicacid) precursors which are coated, imaged, and then thermally converted to their imide form and (2) formulations based on the use of soluble polyimides. There are several disadvantages to using formulations based on poly(amic-acid) precursors including the high curing temperatures required for final ring closure and conversion to their polyimide form, the build-up of film stress during such high temperature curing, and difficulty with swelling and control of the dissolution rate of the poly(amic-acid) precursors during development in aqueous alkaline solutions.…”