With
growing demands arising from technology development for highly
durable and easily moldable materials in flexible electronic devices,
electromagnetic interference (EMI) materials are gradually shifting
from rigid metals to soft polymer composites. Current flexible EMI
shielded materials with high electrical conductivity have limited
mechanical robustness owing to unstable filler–polymer structures
and filler agglomerations. This work prepares highly conductive EMI
shielding materials from steel fibers (SFs) and polypropylene (PP)
composites using extrusion preprocessing and postprocessing methods,
such as compression molding and injection molding. The extrusion process
provides highly crystalline SSF/PP composites with mechanical strength
at break of up to 30 MPa and a high elastic modulus of up to 2.5 GPa.
Extrusion followed by injection processing forms an aligned structure
of SSF and creates β crystalline phases inside the PP matrix.
The SSF/PP composites prepared by the extrusion-injection process
demonstrated flexibility and bending to 180° with full recoverability
and strain to failure of 250% for 0.2–1 vol % and 80% for 2
vol % SSF. 2 vol % SSF/PP composites exhibit a high out-of-plane electrical
conductivity of 0.25 S cm–1, an in-plane electrical
conductivity of 12 S cm–1, an EMI shielding effectiveness
of 25 dB, and a high impact strength of 4.7 kJ m–2. The study provides a facile, scalable, and solvent-free strategy
for high-performance, soft, and durable EMI shielding materials with
great potential for flexible and portable electronics.