Abstract:Ultra thick top metal has been identified as the most promising technology enhancement for RF IC applications. As the top metal's ultra thickness, top via etching will have a high aspect ratio and will easily over etch the via bottom and damage the under layer metal in conventional dual Damascus Cu process. Single Damascus instead of traditional dual Damascus Cu process was selected for thick top metal fabrication to improve the etch window. But a novel failure mode, void formed in via top at anode side is obs… Show more
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