“…However, the traditional circuitlevel and system-level redundancies are not optimistic when being implemented to the nanoscale bulk planar technologies to achieve single event upset (SEU) robustness [2,[9][10][11][12][13][14]. For examples, the Quatro 10 T, Quatro 12 T, 14 T, 18 T, and double interlocked storage cell (DICE) structures seem acceptable for their high critical charges of an upset induced by their multiple redundant nodes, while the level of improvements are not dramatic, and even a tendency of continuously decrease of their SEU thresholds with the shrinking of technologies are clearly characterized by recent work, indicating that merely implementing the SEU tolerance units to replace standard cells seems not enough [13][14][15][16][17][18][19][20][21][22][23][24]. Therefore, for the nanoscale high-integrated circuits, the effective hardening strategies concerning both the units and peripheral circuits are urgently needed to further improve the SEU tolerance of the existing circuits to satisfy the mission-oriented radiation tolerance.…”