2010
DOI: 10.1002/bit.22834
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A novel silicon patch‐clamp chip permits high‐fidelity recording of ion channel activity from functionally defined neurons

Abstract: We report on a simple and high‐yield manufacturing process for silicon planar patch‐clamp chips, which allow low capacitance and series resistance from individually identified cultured neurons. Apertures are etched in a high‐quality silicon nitride film on a silicon wafer; wells are opened on the backside of the wafer by wet etching and passivated by a thick deposited silicon dioxide film to reduce the capacitance of the chip and to facilitate the formation of a high‐impedance cell to aperture seal. The chip s… Show more

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Cited by 28 publications
(36 citation statements)
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“…The process described in 6 results in a 3 μm thick self-standing film, a low 1 Mohm access resistance and a smooth-surfaced funnel shaped aperture that facilitates an intimate seal with the cell 9 , see Figure 2. The chips are singulated and glued in Plexiglas packages with the aperture facing a hole connecting the chip to a subterranean channel.…”
Section: Chip Fabricationmentioning
confidence: 99%
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“…The process described in 6 results in a 3 μm thick self-standing film, a low 1 Mohm access resistance and a smooth-surfaced funnel shaped aperture that facilitates an intimate seal with the cell 9 , see Figure 2. The chips are singulated and glued in Plexiglas packages with the aperture facing a hole connecting the chip to a subterranean channel.…”
Section: Chip Fabricationmentioning
confidence: 99%
“…An impedance meter is used to confirm that the access resistance is between 300kohm and 3Mohm and the shunt capacitance is between 10pF and 25pF. A chip with a lower resistance is likely to have a leak, and a higher capacitance is considered improper for use as it may not capture the fastest dynamics of the cell′s electrophysiology 6 . A chip with a lower capacitance or higher resistance is considered plugged, though it could be simply that a bubble is trapped in the orifice.…”
Section: Sterilization Priming and Testingmentioning
confidence: 99%
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“…(3b). The fabrication procedure was amended from [12]. Apertures were etched in a 1 μm thick silicon nitride film, and inverted pyramid-shaped wells were etched anisotropically in a KOH solution from the back of the wafer.…”
Section: Introductionmentioning
confidence: 99%
“…(2a). Detailed fabrication procedures have been presented previously [12] and follow the procedure described above for the sieve chip. Single-aperture neurochips were made functional, i.e.…”
Section: Introductionmentioning
confidence: 99%