2017
DOI: 10.1109/tcpmt.2016.2635581
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A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage Characterization

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Cited by 17 publications
(4 citation statements)
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“…At the beginning, a tested specimen need to be prepared applying a unique pattern of random speckles/dots on its surface. The speckle pattern can be the natural texture of the specimen surface [ 31 , 32 , 41 ]. In this work, we have conducted many tests to obtain reliable DiC conditions.…”
Section: Experiments Setup and Resultsmentioning
confidence: 99%
“…At the beginning, a tested specimen need to be prepared applying a unique pattern of random speckles/dots on its surface. The speckle pattern can be the natural texture of the specimen surface [ 31 , 32 , 41 ]. In this work, we have conducted many tests to obtain reliable DiC conditions.…”
Section: Experiments Setup and Resultsmentioning
confidence: 99%
“…Other techniques can be applied as well [1]. The speckle-free DIC method was also developed and applied [14]. A special preparation of the specimen surface with the pattern containing the characteristic speckles enables the observation of the changes in the position of these dots during the deformation period [12,15,16,17].…”
Section: Fundamentals Of Dicmentioning
confidence: 99%
“…There has been significant work in the field involving projected patterns for 3D shape measurement [7], [8]; however, exploration into using white-light projection for supplying the random speckle pattern needed for DIC is relatively new and sparse. A DIC-based method called virtual speckle pattern DIC (VSP-DIC) was introduced by Niu et al [9] in 2017, where a 3D DIC system was used to measure the static warpage of packaged electronic components by correlating a projected speckle pattern within the stereo images and between frames. 3D DIC uses two synchronized and calibrated cameras to obtain displacements in both in-plane and out-of-plane directions through triangulation; however the calibration process is tedious and sensitive, and the need for two cameras adds costs and complexity.…”
Section: Introductionmentioning
confidence: 99%