A novel way for fabricating ultrafine grained Cu-4.5 vol% Al2O3 composite with high strength and electrical conductivity

Li, Chenguang; Xie, Yuehuang; Zhou, Dengshan; Zeng, Wei; Wang, Jun; Liang, Jiamiao; Zhang, Deliang

doi:10.1016/j.matchar.2019.06.017

Cited by 41 publications

(9 citation statements)

References 37 publications

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“…The strengthening and toughening of the composite can be directly affected by grain refinement. [ 19 ] Additionally, the 550 °C prepared CPD/Cu composite has a narrower grain size distribution from 0.31 to 4.91 μm, whereas the 800 °C prepared CPD/Cu composite has a wide grain size distribution from 0.91 to 16.71 μm. It shows that the increase of sintering of temperature leads to the increase of grain size of the matrix.…”

Section: Resultsmentioning

confidence: 99%

Rapid and Full Densification of Carbonized Polymer Dot/Copper Composites by Low‐Temperature Sintering

Zhao

Bao

et al. 2023

Adv Eng Mater

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To accomplish densification, pure copper (Cu) sintering, which is a solid phase sintering, necessitates extremely high pressure and temperature. The inclusion of an activator can speed up the diffusion of copper atoms, allowing the densification process to proceed more quickly. The carbonized polymer dot (CPD) via ball milling and spark plasma sintering to obtain a composite with full densification at low temperatures. Effects of sintering temperature on interface of CPD–Cu and the impact of CPD as an activator on pure Cu sintering densification are investigated in this study. Following are the results: Cu matrix composites can be densified at low temperatures by adding CPD, CPD/Cu composites have a relative density of 99.4%, and a hardness up to 130.94 HV while sintering temperature is just 550 °C.

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Section: Resultsmentioning

confidence: 99%

Rapid and Full Densification of Carbonized Polymer Dot/Copper Composites by Low‐Temperature Sintering

Zhao

Bao

et al. 2023

Adv Eng Mater

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“…At the same time, the increase of copperplated graphite leads to more interfaces. The mean free path of electron carriers decreases resulting in a decrease in conductivity [26,27]. Thirdly, voids formed during sintering serves as an obstacle to the electron motion [28].…”

Section: Density and Electrical Conductivity Of Copper/graphite Compo...mentioning

confidence: 99%

Properties and microstructure of copper/graphite composites with copper‐coated graphite fabricated by electroless plating and spark plasma sintering

Feng

Xiao

et al. 2022

Materialwissenschaft Werkst

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In order to improve the interfacial bonding between copper and graphite, copper was coated on the graphite by electroless plating. Copper/graphite composites with copper‐coated graphite were fabricated by spark plasma sintering. The effects of copper‐coated graphite on the density, electrical conductivity, mechanical properties, friction and wear properties of copper/graphite composites were studied. The results show that: copper plating on the graphite surface can improve the wettability of graphite and copper, and the interface between them is well bonded. Compared with pure copper, the microstructure of the composites was significantly refined after adding copper‐coated graphite. The mechanical properties of the composites were significantly improved, with yield compressive strength and elastic modulus increasing by 220 % and 240 %, respectively. With the increase of copper‐coated graphite contents, the density and the conductivity of the composites gradually decreased. The friction coefficient and wear rate of the composites were significantly reduced. The friction and wear mechanisms of the composites are mainly oxidation wear, fatigue wear and adhesive wear.

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“…And it is suitable for nearly all kinds of metallic materials. Successful examples have already been reported in Al [39][40][41], Mo [42] and steel [43][44][45], Mg [46], Cu [47], CoCrFeN-iMn high entropy alloys [48], etc. The key to fully develop this unique strategy relies on the methods to introducing nano-dispersoids.…”

Section: Strategies To Improve the Ductility Of Ufg/ng Materialsmentioning

confidence: 99%

Simultaneous enhancement of strength and ductility with nano dispersoids in nano and ultrafine grain metals: a brief review

Hu¹,

Fan

et al. 2020

Reviews on Advanced Materials Science

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Grain refinement is the most universal and effective method of strengthening metallic materials, which is known as the “Hall-Petch” relationship. However, when grain size is refined to sub-micro regime (Ultrafine Grain, UFG) or even nano regime (Nano Grain, NG), the plasticity of metallic materials becomes poor. Massive studies indicate that the low strain hardening ability resulted from the enhanced dynamic recovery and lack of dislocation accumulation in fine grains is the main reason for low ductility in UFG/NG metals. To resolve this “strength-ductility” conflict, different strategies have been taken, like bimodal/multimodal structure, nanotwins, gradient structure and intragranular nano dispersoids. Among them, the introduction of nano dispersoids into the fine grains attracted lots of attention due to its wide applicability and great success in simultaneously increasing the strength and ductility of the UFG/NG metal. In addition to the enhanced mechanical performance, the introduced second-phase particle may also bring some extraordinary functional properties into the metallic material. In this paper, a brief view of the strategies to improve ductility of the UFG/NG metals and the relevant toughening mechanisms are revealed. Special attentions are paid to the utilization of intragranular nano dispersoids in Aluminum alloys.

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A novel way for fabricating ultrafine grained Cu-4.5 vol% Al2O3 composite with high strength and electrical conductivity

Cited by 41 publications

References 37 publications

Rapid and Full Densification of Carbonized Polymer Dot/Copper Composites by Low‐Temperature Sintering

Rapid and Full Densification of Carbonized Polymer Dot/Copper Composites by Low‐Temperature Sintering

Properties and microstructure of copper/graphite composites with copper‐coated graphite fabricated by electroless plating and spark plasma sintering

Simultaneous enhancement of strength and ductility with nano dispersoids in nano and ultrafine grain metals: a brief review

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A novel way for fabricating ultrafine grained Cu-4.5 vol% Al2O3 composite with high strength and electrical conductivity

Cited by 41 publications

References 37 publications

Rapid and Full Densification of Carbonized Polymer Dot/Copper Composites by Low‐Temperature Sintering

Rapid and Full Densification of Carbonized Polymer Dot/Copper Composites by Low‐Temperature Sintering

Properties and microstructure of copper/graphite composites with copper‐coated graphite fabricated by electroless plating and spark plasma sintering

Simultaneous enhancement of strength and ductility with nano dispersoids in nano and ultrafine grain metals: a brief review

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A novel way for fabricating ultrafine grained Cu-4.5 vol% Al2O3 composite with high strength and electrical conductivity