Thin film evaporation modeling is commonly used to simulate transport phenomena in two phase capillary cooling devices and microchannels. However, one of the difficulties faced in the application of such models is the absence of consensus in the implementation of boundary conditions. In the present work, different methods available in the literature are analyzed for their capability to model the physics of the problem. Both their strengths and shortcomings are highlighted. Hence, a novel method for estimation of the film thickness at the onset of evaporation is presented. It is tested for a wide range of superheats and is found to give physically realistic results. A new thin film evaporation model is also presented, consisting of the velocity slip boundary condition at the wall and a disjoining pressure consisting of both retarded and nonretarded terms. It is found that the heat flux decreases monotonically throughout the thin film region.