A numerical model for soldering process in silicon solar cells

Esfahani, Sajedeh Nasr; Asghari, Saeed; Rashid-Nadimi, Sahar

doi:10.1016/j.solener.2017.03.065

Cited by 30 publications

(7 citation statements)

References 20 publications

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“…The thermo-mechanical behavior of busbar PV module during manufacturing and subsequent life stages has been investigated in these studies: manufacturing process is analyzed by studies [9][10][11][12][13][14][15][16]; cracking effect on output or behavior is analyzed by studies [17][18][19][20][21][22]; behavior during application of different kind of loads is analyzed by studies [1,13,[21][22][23][24][25][26][27][28]. However, the existing studies did not include the initial stresses or pre-stresses in their analysis except studies [9,11,16], but they [9,11,16] studied production stage only.…”

Section: Accepted Manuscriptmentioning

confidence: 99%

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Thermo-mechanical behavior assessment of smart wire connected and busbarPV modules during production, transportation, and subsequent field loading stages

Akram

Jin

et al. 2019

Energy

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Thermo-mechanical loads induce stresses in photovoltaic (PV) modules, leading to crack formation.In this context, the understanding of module's thermo-mechanical behavior is important. To investigate the thermo-mechanical behavior of smart wire connected technology (SWCT) and busbar PV modules throughout their entire life, the present study is conducted that probes the stress distribution and deformation during production, transportation, and subsequent mechanical and thermal loading stages in a consecutive step-by-step manner using finite element modelling approach.Pre-stresses and non-linearities are considered in simulation models. Stresses and displacements experienced by different parts/layers are examined, and crack sensitive regions are identified. In addition, the SWCT and busbar modules are compared, and it is found that SWCT interconnection is relatively a less stress inducing process and less susceptible to thermal and dynamic affects. During production stage, stresses of 39.3 MPa and 40.4 MPa are generated in SWCT cells and copper wires ACCEPTED MANUSCRIPT 2 respectively; while, stresses of 60 MPa and 87 MPa are generated in busbar cells and busbar respectively. Similarly, lower stresses are induced in SWCT PV modules during subsequent stages.The comparison results show advantages of SWCT module in terms of mechanical stability which can lead to improve the performance and reliability of PV modules.

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Section: Accepted Manuscriptmentioning

confidence: 99%

“…condition of zero displacement is applied in one direction. thermal load caused by soldering step[10]. Subsequently, the model is cooled down to room temperature (25 o C) to simulate the heat transfer to room environment.The lamination process for both busbar and SWCT cells are simulated on a simplified quarter PV panel model using symmetry conditions.…”

mentioning

confidence: 99%

Thermo-mechanical behavior assessment of smart wire connected and busbarPV modules during production, transportation, and subsequent field loading stages

Akram

Jin

et al. 2019

Energy

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“…PV modules are normally protected by an aluminium body and laminated‐glass [1]. However, these protection schemes cannot constantly avoid thermal and mechanical damages during the manufacturing process, transportation, and handling the PV module during installation [2]. Even after installation, the modules are exposed to natural hazards such as raining, lightning, snow falling, and wind during operation in the field.…”

Section: Introductionmentioning

confidence: 99%

Photovoltaic cell defect classification using convolutional neural network and support vector machine

Ahmad

Jin

Zhu

et al. 2020

IET Renewable Power Generation

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“…In addition, wafer thickness can be further decreased to 120 µm through future innovative technological advances in solar cells and PV modules. However, it is acknowledged that thin wafers may increase mechanical failures during the manufacturing process [2][3][4][5][6][7][8][9]. Mechanical failures arise from the difference in the coefficients of thermal expansion (CTE) of materials.…”

Section: Introductionmentioning

confidence: 99%

Thermal Residual Stress Analysis of Soldering and Lamination Processes for Fabrication of Crystalline Silicon Photovoltaic Modules

et al. 2018

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In this study, we developed a finite element model to assess the residual stress in the soldering and lamination processes during the fabrication of crystalline silicon (Si) photovoltaic (PV) modules. We found that Si wafers experience maximum thermo-mechanical stress during the soldering process. Then, the Si solar cells experience pressure during the process of lamination of each layer of the PV module. Thus, it is important to decrease the residual stress during soldering of thin Si wafers. The residual stress is affected by the number of busbars, Si wafer thickness, and solder type. Firstly, as the number of busbars increases from two to twelve, the maximum principal stress increases by almost a factor of three (~100 MPa). Such a high first principal stress can cause mechanical failure in some Si wafers. Secondly, thermal warpage increases immediately after the soldering process when the thickness of the Si wafers decreases. Therefore, the number and width of the busbars should be considered in order to avoid mechanical failure. Finally, the residual stress can be reduced by using low melting point solder. The results obtained in this study can be applied to avoid mechanical failure in PV modules employing thin Si wafers.

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A numerical model for soldering process in silicon solar cells

Cited by 30 publications

References 20 publications

Thermo-mechanical behavior assessment of smart wire connected and busbarPV modules during production, transportation, and subsequent field loading stages

Thermo-mechanical behavior assessment of smart wire connected and busbarPV modules during production, transportation, and subsequent field loading stages

Photovoltaic cell defect classification using convolutional neural network and support vector machine

Thermal Residual Stress Analysis of Soldering and Lamination Processes for Fabrication of Crystalline Silicon Photovoltaic Modules

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