A Numerical Study on the Influence of Nanosilica‐Reinforced Epoxy Resin on the Delamination Behavior of Composite Laminates

Abstract

The use of nanomodified epoxy resins can potentially increase composites application to aeronautical structural components, thanks to the potential enhancement, in terms of physical and mechanical properties, when compared to the neat epoxy matrix. In this work, the effects of silica nanoparticles (NPs) on the fracture toughness and, consequently, the crack growth resistance of fiber-reinforced polymers (FRPs) have been numerically investigated. The skin-stringer debonding initiation and growth have been studied by a tailored innovative numerical procedure considering an aeronautical panel reinforced with a single T-shape stringer, made of carbon fibers/epoxy resin material, and subjected to compressive load. An analytical model has been used to evaluate the Mode I fracture toughness value of the nanomodified resin, and the Virtual Crack Closure Technique methodology has been employed to assess the delamination growth in the frame of a Finite Elements (FE) analysis performed in the Ansys FE environment. Numerical results presenting the comparison between charged and neat configurations have been assessed to provide a first understanding of the influence of nanoparticles on the static delamination growth in geometrically complex composite structures.

Mode I and mode II fracture behavior in nano‐engineered long fiber reinforced composites

“…The incorporation of nanomaterials (carbon nanotubes (CNTs), graphene, nanoclay, nanosilica, and so forth) into composites to form nano-engineered composites has been investigated in the literature with the aim of improving their strength, [1,2] stiffness, [3] fracture toughness, [4] and fatigue properties. [5,6] Since the synthesis of CNTs in the 1990s, [7] this type of nanomaterial has been widely investigated due to its excellent mechanical properties, as well as its high thermal [8] and electrical conductivity. [9] In the literature, a noticeable enhancement in the thermal conductivity of resin-CNTs samples has been observed.…”

3D numerical investigation on delamination behavior of the epoxy impregnated REBCO pancake coil

“…Because the tensile radial stress is mainly caused by the thermal expansion coefficient (CTE) mismatch between the REBCO CC and the epoxy resin layer in the epoxy impregnated REBCO pancake coil. In this regard, the investigation showed that the thermal stress can be reduced by modifying the CTE of the epoxy resin by adding fillers to the epoxy resin [38][39][40][41]. Meanwhile, the overband fabrication technology is also widely used in the epoxy impregnated REBCO pancake coil or no-insulation REBCO coil to reduce the radial and hoop stresses [42][43][44].…”