A partially insulated interface crack between a graded orthotropic coating and a homogeneous orthotropic substrate under heat flux supply

Zhou, Yueting; Xing, Li; Yu, Dehao

doi:10.1016/j.ijsolstr.2009.11.009

Cited by 49 publications

(26 citation statements)

References 40 publications

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“…where the functions A s 8) stand for the roots of the following characteristic equation with respect to α…”

Section: Solution Proceduresmentioning

confidence: 99%

“…For the purely elastic and functionally graded materials, a considerable number of physic and mechanic problems have been addressed [3][4][5][6][7][8]. Recently, the idea of functionally graded materials has been extended to piezoelectric and magnetoelectroelastic materials [9][10][11][12][13][14] due to their multi-fields coupling effects and potential applications in manufacturing smart devices [15].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Dielectric crack problem for a magnetoelectroelastic strip with functionally graded properties

Zhong

Lee

2011

Arch Appl Mech

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The paper presents a fracture analysis for an electromagnetically dielectric crack in a functionally graded magnetoelectroelastic strip. It is considered that the material properties are varying exponentially along the width direction. Under the assumption of the in-plane magneto-electro-mechanical loadings, the dielectric crack is simulated by using the semi-permeable crack-face boundary conditions. The Fourier transform technique is applied to solve the boundary-value problem and four coupling singular integral equations are determined. A nonlinear system of algebraic equations is further derived and solved numerically to determine the electromagnetic field inside the crack. Then the field intensity factors of stress, electric displacement, and magnetic induction are given. Through the numerical computations, the effects of the material non-homogeneity and the permeability of crack interior on the electric displacement and the magnetic induction at the crack faces are studied. The variations of the intensity factors of stress, electric displacement, and magnetic induction versus the geometry of the crack, the strip width, and the material non-homogeneity are presented in graphics respectively.

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“…where the functions A s 8) stand for the roots of the following characteristic equation with respect to α…”

Section: Solution Proceduresmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Dielectric crack problem for a magnetoelectroelastic strip with functionally graded properties

Zhong

Lee

2011

Arch Appl Mech

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“…In the abovementioned works and other works [26][27][28][29][30][31][32], the partially insulated boundary condition is mainly used and the closed-form solutions have been obtained for the thermoelastic field around the penny-shaped crack under the loading of uniform heat flow.…”

Section: Introductionmentioning

confidence: 99%

Thermoelastic Analysis for Two Collinear Cracks in an Orthotropic Solid Disturbed by Antisymmetrical Linear Heat Flow

Jun-gao

Peng

et al. 2017

Mathematical Problems in Engineering

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The problem of two collinear cracks in an orthotropic solid under antisymmetrical linear heat flow is investigated. It is assumed that there exists thermal resistance to heat conduction through the crack region. Applying the Fourier transform, the thermal coupling partial differential equations are transformed to dual integral equations and then to singular integral equations. The cracktip thermoelastic fields including the jumps of temperature and elastic displacements on the cracks and the mode II stress intensity factors are obtained explicitly. Numerical results show the effects of the geometries of the cracks and the dimensionless thermal resistance on the temperature change and the mode II stress intensity factors. Also, FEM solutions for the stress intensity factor are used to compare with the solutions obtained using the method. It is revealed that the friction in closed crack surface region should be considered in analyzing the stress intensity factor .

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“…The crack-face thermal boundary condition (1) has been used widely such as Kuo (1990), Thangjitham and Choi (1993), Lee and Park (1995) and Zhou et al (2010). Unfortunately, the parameter h c can not perfectly reveal the thermal conductivity of the medium inside a crack.…”

Section: Introductionmentioning

confidence: 99%

Thermoelastic analysis for an opening crack in an orthotropic material

Zhong

2012

Int J Fract

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The thermoelastic analysis of an opening crack embedded in an orthotropic material is made under applied uniform heat flux and mechanical loadings. To simulate the case of an opening crack filled with a medium, a thermal-medium crack model is proposed. The thermally permeable and impermeable cracks are the limiting ones of the proposed thermal-medium one. The crack-tip thermoelastic fields induced by a crack in an orthotropic material are determined in closed forms. The elastic T-stress can be also obtained explicitly. The effects of applied mechanical loadings and the thermal conductivity of crack interior on the heat flux at the crack surfaces and the mode-II stress intensity factor are investigated through numerical computations. The obtained results reveal that an increase of the thermal conductivity of crack interior decreases the mode-II stress intensity factor. And when an applied mechanical loading is increasing, the mode-II stress intensity factor is rising.

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A partially insulated interface crack between a graded orthotropic coating and a homogeneous orthotropic substrate under heat flux supply

Cited by 49 publications

References 40 publications

Dielectric crack problem for a magnetoelectroelastic strip with functionally graded properties

Dielectric crack problem for a magnetoelectroelastic strip with functionally graded properties

Thermoelastic Analysis for Two Collinear Cracks in an Orthotropic Solid Disturbed by Antisymmetrical Linear Heat Flow

Thermoelastic analysis for an opening crack in an orthotropic material

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