A Parylene Temporary Packaging Technique for MEMS Wafer Handling

Wen, Lianggong; Wouters, Kristof; Ceyssens, Frederik; Witvrouw, Ann; Puers, Robert

doi:10.1016/j.proeng.2011.12.371

Cited by 2 publications

(1 citation statement)

References 5 publications

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“…Also, among all the detection principles, capacitive differential accelerometers feature high sensitivity, stable DC-characteristics, low drift, low power dissipation and low temperature sensitivity (17). Therefore, to realize differential capacitive accelerometer by above-IC integration shows great promise.…”

Section: Accelerometersmentioning

confidence: 99%

(Invited) SiGe MEMS Technology: A Platform Technology Enabling Different Demonstrators

Witvrouw¹,

Hoof²,

Bryce³

et al. 2010

ECS Trans.

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In imec's 200mm fab a dedicated poly-SiGe above-IC MEMS (Micro Electro-Mechanical Systems) platform has been set up to integrate MEMS and its readout and driving electronics on one chip. In the Flemish project Gemini the possibilities of this platform have been further explored together with the project partners. Three different demonstrators were realized: mirrors for display applications, grating light valves (GLV) and accelerometers. Whereas the mirrors and GLVs are made with a ~300 nm thick SiGe structural layer plus optical coating, the SiGe structural layer thickness for the accelerometers is 4µm in order to improve the capacitive readout of in-plane devices. The processing and measurement results of these functional demonstrators are shown in this paper. These new demonstrators reconfirm the generic nature of the SiGe MEMS platform.

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Section: Accelerometersmentioning

confidence: 99%