A percolative approach to investigate electromigration failure in printed Ag structures

Zhao, Zhao; Mamidanna, Avinash; Lefky, Christopher S.; Hildreth, Owen; Alford, Terry

doi:10.1063/1.4963755

Cited by 26 publications

(13 citation statements)

References 31 publications

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“…In contrast, Ag inks are conductive as‐printed and can be made more conductive by annealing, but they can be susceptible to electromigration. [ 24 ] The Al/ZrC cermet product is expected [ 13 ] to be more electromigration‐resistant, which could be useful in high‐current density applications. However, it is challenging to directly assess the product's electromigration‐resistance, as standard test apparatus are designed for significantly lower resistivity materials.…”

Section: Figurementioning

confidence: 99%

Multifunctional Reactive Nanocomposites via Direct Ink Writing

Arlington

Barron

DeLisio

et al. 2021

Adv Materials Technologies

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3D printing of reactive materials has, to date, primarily focused on controlling reaction velocities and energy release rates by printing novel architectures, which during reaction typically form gaseous and oxide powder products. The utility of printed reactive materials can be increased by designing the material such that its reaction produces both a controlled energy release and a functional product phase without gaseous products. Here, we report the direct ink writing of reactive materials composed of ternary nanocomposite powders that exhibit gasless, exceptionally low velocity reactions. The printed features can be patterned in arbitrary form factors and are brittle and electrically insulating as‐printed. Using a self‐propagating synthesis reaction, these features can be transformed into a mechanically robust, electrically conductive cermet that is capable of handling high currents. This study provides a new paradigm for printing multifunctional reactive materials in which both the energy release of the reaction, as well as the reaction products themselves, are useful for potential applications ranging from printed electronic devices to controlled, directed energy release.

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Section: Figurementioning

confidence: 99%

Multifunctional Reactive Nanocomposites via Direct Ink Writing

Arlington

Barron

DeLisio

et al. 2021

Adv Materials Technologies

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“…[6] The current state of the art in 3D printed conductors is reactive silver inks able to reach bulk or near bulk conductivity after sintering at moderate temperatures. [8] The resulting systems are not yet truly competitive with traditional conductors such as metallic copper. [8] The resulting systems are not yet truly competitive with traditional conductors such as metallic copper.…”

Section: Doi: 101002/admt201900126mentioning

confidence: 99%

Selective Electroplating for 3D‐Printed Electronics

Lazarus

Bedair

Hawasli

et al. 2019

Adv Materials Technologies

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In this paper, we demonstrate electroplating copper and nickel selectively onto traces printed in a highly conductive thermoplastic composite filament and use of the resulting bulk metal conductors for 3D printed electronics packaging. Electroless plating has long been used for metallization of polymer 3D printed parts [9,10] to obtain superior mechanical and electrical properties, but results in blanket deposition of metal over the entire part. Since most 3D printable plastics are difficult to directly electrolessly plate, metallization through this technique is typically a multistep process requiring roughening [11] and surface activation [12] for proper plating. Creating separate electrodes using electroless plating requires additional steps to define the conductors, for instance through laser ablation, [13] variable swelling, [14] or mechanical polishing. [15] In 2017, researchers demonstrated that conductive polymer composites can be used as a conductive seed layer for electroplating. [16] Based on this finding, we demonstrated selective electroplating of a 3D printed fused filament fabrication (FFF) part, combining conductive composite filament to define plated regions with a nonconductive plastic as a mechanical support. [17] Fused filament fabrication, the extrusion of melted thermoplastics to build a part, is a cheap and widely available 3D printing technology. [18] While successful, the composite we used was resistive relative to traditional electroplating seed layers, requiring electrical contact near the region being plated and therefore strongly limiting the complexity of the resulting parts and preventing use for electronics packaging. Building on our work, a group at Southeast University in China subsequently demonstrated the use of a similar dual filament FFF 3D printing process to define regions for selective electroless plating through selective adhesion onto two different printable polymers and showed its use for 3D printed electronic packaging. [19] Electroless plating is however significantly slower than electroplating, [20] limiting possible deposition thickness, and also unlike electroplating lacks the ability to selectively plate different thicknesses or materials on the same part. A more detailed survey of past work on electro-and electroless plating of 3D printed parts was also given in ref. [17].Here, we use a very low resistivity filament to plate centimeters from the contact point and demonstrate the ability to selectively plate complex 3D parts such as electronic packages and 3D printed circuit boards (PCBs). A very low resistivity copperbased FFF filament developed at Duke University and commercialized under the name Electrifi [21] was recently demonstrated Creating 3D-printed parts with embedded circuitry is the next frontier in additive manufacturing, but printing of conductors with performance comparable to bulk metals such as copper is a difficult challenge. A hybrid process based on 3D printing followed by electroplating on highly conductive thermoplastic filament is used to ma...

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“…In the past, many studies have been performed using different conductive materials, including carbon nanotubes, graphene, conductive polymers, and metal nanowires, for use as electrodes fabricated through a solution process. − Among them, silver nanowires (AgNWs) have attracted considerable attention as alternative electrode materials for ITO because they can achieve high conductivity, transmittance, flexibility at a low manufacturing cost, and low intrinsic toxicity. − However, the distribution of AgNWs on the plastic substrate is not well controlled, the junctions between AgNWs are uneven, and the surface is roughened by random nanowire stacking behavior, − which consequently degrades the corresponding device performance despite many developments because some of the previous methods can damage the substrate or can only be applied to a specific substrate . In addition, all these approaches had the common drawback that AgNWs weakly adhered to the substrate and resulted in poor junctions between the nanowires.…”

Section: Introductionmentioning

confidence: 99%

Patterned Sandwich-Type Silver Nanowire-Based Flexible Electrode by Photolithography

Kim

Kwon

Park

et al. 2021

ACS Appl. Mater. Interfaces

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Silver nanowires (AgNWs) are one of the important flexible electrode material candidates that can replace brittle indium tin oxide (ITO). In this work, we demonstrated novel patterned sandwich-type AgNW-based transparent electrodes easily prepared using the photolithography method for application in flexible devices. A cross-linked underlayer was introduced to increase the adhesion properties between a poly(ethylene terephthalate) substrate and AgNWs, and as a result, a uniform AgNW layer was easily deposited. Finally, the AgNW layer could be easily patterned by introducing a photocross-linkable upper layer without lift-off, dry transfer, and removal methods. A mixture of poly(sodium-4-styrene sulfonate) (PSS–Na+) and 2,4-hexadiyne-1,6-diol (HDD), which is a component of the upper layer, exhibited good cross-linking properties as well as excellent adhesion to the AgNW layer. Through the above method, it was possible to easily fabricate a patterned electrode with smooth surface morphology. Moreover, AgNW-based patterned electrodes exhibit good optical and electrical properties (R s = 29.8 Ω/□, T 550 nm = 94.6%), making them suitable for optoelectronic devices. Flexible polymer solar cells (PSCs) using patterned AgNW electrodes showed a high power conversion efficiency of over 10%, which is comparable to that of PSCs using rigid ITO electrodes. In addition, the high mechanical stability of AgNW-based PSCs was confirmed by bending experiments.

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A percolative approach to investigate electromigration failure in printed Ag structures

Cited by 26 publications

References 31 publications

Multifunctional Reactive Nanocomposites via Direct Ink Writing

Multifunctional Reactive Nanocomposites via Direct Ink Writing

Selective Electroplating for 3D‐Printed Electronics

Patterned Sandwich-Type Silver Nanowire-Based Flexible Electrode by Photolithography

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