“…Copper oxides (CuO, (Cu 2 0)) [158,175], zinc oxide (ZnO) [138], silicon (Si) [176], titanium(IV) oxide (TiO 2 ) [159] Anodization [175], hydrothermal growth [158,159], nanoimprint lithography [176], reversal nanoimprint lithography(RNIL) with simultaneous thermal and ultraviolet (UV)(STU) exposure [152] Nanowires Silicon (Si) [177][178][179], copper (Cu) [180], nickle-copper oxide (Ni-CuO) [181], zinc oxide (ZnO) [165], gold (Au) [182], silver (Ag) [123,183] NiO 1−x [184] Wet chemical etching [177,178], photolithography [179,182], anodization [184], electron deposition [184], polyol process [123,183], hydrothermal growth [123] 2D and quasi-3D Nanosheets Molybdenum disulfide (MoS 2 ) [185], polyaniline (PANI) [156,186], Tantalum nickel sulfide (Ta 2 NiS 2 ) [187], Tantalum nickel selenium (Ta 2 NiSe 2 ) [187], graphene oxide [188], cobalt oxyhydroxide (CoOOH) [189], manganese(IV) oxide (MnO 2 ) [190], reduced graphene oxide (rGO) [191] Lithography/Lift-off process [156], bilayer lithography and chemical polymerization [156], electrochemical Li-intercalaction and exfoliation method…”