A Physical Surface Roughness Model and Its Applications

Gold, G.; Helmreich, K.

doi:10.1109/tmtt.2017.2695192

Cited by 143 publications

(62 citation statements)

References 16 publications

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“…The results are depicted in Figure , together with the results based on the traditional formula of Hammerstad and Jensen . There is a good agreement between the proposed method and the conductivity gradient method . However, the traditional Hammerstad‐Jensen formula shows large errors when the frequency increases …”

Section: Numerical Resultsmentioning

confidence: 83%

“…The roughness of the ground plane is same as the signal trace, that is, 1.0 μm. Using the conductivity gradient model, the impact of the roughness can be modeled by an effective, frequency‐dependent conductivity of an equivalent smooth conductor that yields the same power loss as the conductor with rough surface. The correction factor K H for the gradient method can then be calculated as the ratio of the power loss in the new topology to the power loss in the smooth topology without any roughness.…”

Section: Numerical Resultsmentioning

confidence: 99%

“…The correction factors modeling the conductor surface roughness calculated with the method proposed in this paper, with the conductivity gradient model, and with the Hammerstad formula of Ref. …”

Section: Numerical Resultsmentioning

confidence: 99%

“…2 There is a good agreement between the proposed method and the conductivity gradient method. 10 However, the traditional Hammerstad-Jensen formula shows large errors when the frequency increases. 2 Consider the same microstrip line as above with known correction factor K H but with a dielectric permittivity and dissipation factor that need to be determined.…”

Section: Numerical Resultsmentioning

confidence: 99%

“…Once the actual value of γ is known (through measurements or simulations), the correction factor can be extracted from the known geometry of the microstrip and the dielectric parameters of the substrate since the correction factor is related with the P.U.L. distributed parameters RLCG.…”

Section: Correction Factormentioning

confidence: 99%

See 4 more Smart Citations

Simple conductor roughness modeling for microstrip lines

Huang

Wang

Vandenbosch

2019

Micro & Optical Tech Letters

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The accurate characterization of the effect of conductor surface roughness in microwave transmission lines is crucial in the analysis and design of microwave circuits, in particular at high frequencies. This paper proposes an accurate correction factor based method to calculate the effect of conductor surface roughness from the per‐unit‐length (P.U.L.) parameters and the complex propagation constant of a microstrip line. Then, this correction factor is applied to extract the dielectric properties of microstrip lines, thus taking into account the conductor surface roughness. The simulation results show a good agreement with the given standard values.

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Section: Numerical Resultsmentioning

confidence: 83%

Section: Numerical Resultsmentioning

confidence: 99%

Section: Numerical Resultsmentioning

confidence: 99%

Section: Numerical Resultsmentioning

confidence: 99%

Section: Correction Factormentioning

confidence: 99%

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Simple conductor roughness modeling for microstrip lines

Huang

Wang

Vandenbosch

2019

Micro & Optical Tech Letters

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Design of substrate integrated waveguides based on nanowires: Numerical guidelines

Kerckhoven

Piraux

Huynen

2021

Int J Numerical Modelling

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A thorough study of the parameters influencing the operation of devices based on nanowired alumina substrate is presented. The basic structures are realized by growing metallic nanowires inside alumina porous substrate. The control of the areas wherein growth occurs allows building of various microwave devices supported on the filled template. The performances of these devices depend on the material parameters and topology/geometry in presence. These devices have the particularity to combine nanoscale, through the use of nanowires, and millimeter scale that is characteristic of microwave devices and their associated operating wavelength. The gap between the two‐scale ranges implies that analytical models and numerical simulation tools have to be combined to modelize and design performant microwave devices, such as Nanowired Substrate Integrated Waveguides (NSIWs) devices that are the subject of the paper. A deep parametric analysis of the properties and operation of the basic NSIW is presented and is followed by the illustration of two designs: a simple NSIW line, and an EBG NSIW filter.

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3D modeling of inductive and capacitive coupling between surface‐mounted multilayer‐capacitors

Riener

Bauernfeind

Baumgartner

et al. 2022

Int J Numerical Modelling

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Electronic based systems (EBS) tend to become smaller in size while at the same time their functionality, complexity, and operating frequencies increase. Therefore, accurate and broadband characterization of the electric behavior of the components of such EBS is becoming more and more important for first‐time right designs, especially for electromagnetic compatibility (EMC) and interference (EMI) issues. Although many of the manufacturers provide the electric characterization of their components up to, for example, 8.5 GHz, there is still a lack of information about the parasitic electromagnetic coupling of their components to others. To characterize this behavior in terms of measurement is demanding due to the small size and the high frequencies, hence the characterization by means of numerical simulations has become popular in the last years. Due to the fact that the components can be quite complex and their structure hard to model and simulate, like it is the case for the here investigated multilayer ceramic capacitors (MLCC), simplified models of the geometry have been typically used. In general, the electromagnetic behavior of multiple components close to each other is of interest, hence numerical efficient models must be deployed to analyze interfering effects toward each other. In the present paper we evaluate different 3D modeling strategies for MLCCs in terms of their capabilities to characterize the mutual coupling between such components.

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A Physical Surface Roughness Model and Its Applications

Cited by 143 publications

References 16 publications

Simple conductor roughness modeling for microstrip lines

Simple conductor roughness modeling for microstrip lines

Design of substrate integrated waveguides based on nanowires: Numerical guidelines

3D modeling of inductive and capacitive coupling between surface‐mounted multilayer‐capacitors

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