A polar polyimide as multifunctional flame retardant for epoxy resin through constructing intimate 3D interpenetrating polymer network

Fan, Zicheng; Noh, Insub; Zhuang, Changlong; Liu, Qingqing; Wang, Yanbin; Kim, Hyung Do; Yue, Meng; Ohkita, Hideo; Wang, Biaobing

doi:10.1016/j.eurpolymj.2023.112383

Cited by 4 publications

(1 citation statement)

References 67 publications

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“…13 Hence, developing packaging materials for high-power devices with excellent thermal stability and intrinsic halogen-free flame retardancy holds significant research importance and an application outlook. It has been well documented that incorporating highperformance thermosetting polymers, such as polyimide, 14 cyanate ester, 15 bismaleimide, 16 and benzoxazine, 17 into epoxy networks to form copolymerization or interpenetrating structure, is a straightforward and effective method for enhancing the heat resistance of epoxy thermosets. For instance, Wong et al 8,9 investigated the copolymer of cyanate ester and epoxy resin, which revealed outstanding thermal properties, (T g above 250 °C and decomposition onset above 400 °C), aging resistance, and dielectric properties, as well as adjustable processability.…”

Section: Introductionmentioning

confidence: 99%

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Huang,

Zhu,

et al. 2024

Ind. Eng. Chem. Res.

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The rapid development of third-generation semiconductor power devices has been driving the requirement for high-temperature stable molding compounds. In this study, three kinds of phthalonitrile-etherified phenolic resins (PNP) with different degrees of etherification were prepared from linear phenolic resin and 4-nitrophthalonitrile by a facile one-pot method. Subsequently, a new electronic packaging molding compound (PEM) was prepared according to the processing method of traditional epoxy molding compounds (EMC), based on the resin blends of the PNP with a 50% etherification and polyfunctional epoxy resin as the resin matrix and triphenylphosphine employed as the curing accelerator. The reaction of the epoxy groups with both the phenol hydroxyl and cyano groups endowed the resin matrix with a high curing activity, thus making the molding process of PEM be compatible with that of EMC. The cured products of PEM showed a much superior thermal performance to that of EMC. For the cured PEM, the glass transition temperature (T g) was up to 300 °C and the coefficients of thermal expansion (CTE) decreased significantly in comparison to EMC, due to the generated rigid structures of oxazoline, isoindoline, triazine, and phthalocyanine, as well as the high cross-linking density. It is worth noting that the cured PEM could achieve a V-0 rating in the UL-94 vertical burning test without the addition of any flame retardants, demonstrating its remarkable intrinsic flame retardancy. Moreover, the cured PEM also exhibited good dielectric properties, thermal conductivity, high temperature aging resistance, and flexural performance at both room temperature and 200 °C. In sum, a promising strategy for the preparation of electronic packaging molding compounds with high T g, low CTE, and intrinsic flame retardancy was provided.

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Section: Introductionmentioning

confidence: 99%

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Huang,

Zhu,

et al. 2024

Ind. Eng. Chem. Res.

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Multifunctional fire-resistant and flame-triggered shape memory epoxy nanocomposites containing carbon dots

Bifulco,

Imparato,

Climaco

et al. 2024

Chemical Engineering Journal

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Construction of self-lapping three-dimensional thermal conduction network in epoxy resin thermosets by incorporating “dendritic” zinc oxide derived from metal-organic framework

Leng,

Sun,

Sun

et al. 2024

Surfaces and Interfaces

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A polar polyimide as multifunctional flame retardant for epoxy resin through constructing intimate 3D interpenetrating polymer network

Cited by 4 publications

References 67 publications

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Multifunctional fire-resistant and flame-triggered shape memory epoxy nanocomposites containing carbon dots

Construction of self-lapping three-dimensional thermal conduction network in epoxy resin thermosets by incorporating “dendritic” zinc oxide derived from metal-organic framework

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A polar polyimide as multifunctional flame retardant for epoxy resin through constructing intimate 3D interpenetrating polymer network

Cited by 4 publications

References 67 publications

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High Tg, Low CTE, and Intrinsic Flame Retardancy

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High Tg, Low CTE, and Intrinsic Flame Retardancy

Multifunctional fire-resistant and flame-triggered shape memory epoxy nanocomposites containing carbon dots

Construction of self-lapping three-dimensional thermal conduction network in epoxy resin thermosets by incorporating “dendritic” zinc oxide derived from metal-organic framework

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Product

Resources

About

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy

Phthalonitrile/Epoxy Copolymers Endowing Molding Compounds with High T_g, Low CTE, and Intrinsic Flame Retardancy