A porosity closure model considering stress triaxiality ratio and Lode stress parameter

Zhang, Qi; Niu, Liqun; Liang, Zhenglong; Cao, Miao; Zhou, Tao

doi:10.1016/j.jmatprotec.2020.116824

Cited by 10 publications

(5 citation statements)

References 15 publications

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“…The computed time dependent values of the equivalent stress, pressure and equivalent plastic strain, are presented in Figure 13 for each bonding condition, as a function of normalized process time, at the center of the bonded interface. [26,27]. As a result, higher stress values at the interface are not directly correlated to a stronger bond formation.…”

Section: Discussionmentioning

confidence: 96%

A Study of Interface Bond Strength Following Hot Deformation Bonding of AA6061 at Different Temperatures and Loading Rates

Kayat,

Mittelman,

Fadel

et al. 2024

Preprint

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Multilayered metallic sheets fabricated by hot metal forming processes are attractive structural components in the aerospace and automobile industry. The strength of the mechanical bond between the different layers is critical to the applicability of such components in load bearing applications. While it is well understood that the process conditions such as temperature, deformation and rate of deformation influence the bond strength, a clear functional relationship between these conditions and the bond strength has yet to be established. The objective of the current study is to investigate the joining of Aluminum-6061 alloy specimens by hot compression bonding. Hot compression tests of beam specimen pairs were conducted at different temperatures (300-500℃), with different strains and strain rates (10-2-10-1 [1sec]). Coupled thermo-mechanical finite element models were utilized to compute the time dependent thermo-mechanical fields that develop along the specimen interface. The computed values were used to map the spatial distribution of a scalar parameter J which is hypothesized to govern bond formation. Mechanical tensile tests were used to determine the bond strength and expose the bonded surfaces. It is demonstrated that the computed J distribution can be correlated well with SEM observations of the debonded surface. It is also shown that the actual bonded area can be predicted from the computations for a certain range of critical J values.

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Section: Discussionmentioning

confidence: 96%

A Study of Interface Bond Strength Following Hot Deformation Bonding of AA6061 at Different Temperatures and Loading Rates

Kayat,

Mittelman,

Fadel

et al. 2024

Preprint

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show abstract

“…Early void closure models often considered stress triaxiality only. However, recent studies have revealed that the Lode angle is also a significant parameter influencing void deformation behaviour [2,16,17,19]. In this study, the model coefficients in Equation ( 16) were expressed as polynomial functions of the triaxiality, Lode angle, shape parameters, and direction cosine as follows:…”

Section: Void Closure Modelmentioning

confidence: 99%

“…The geometry and orientation parameters could be calibrated from RVE simulations with different initial void shapes and orientations. Based on the STB model, numerous forms of void volume evolution functions were proposed [16][17][18][19].…”

Section: Introductionmentioning

confidence: 99%

A Geometry-Dependent Void Closure Model Considering Void Deformation and Orientation Changes during Hot Metal Formation

Kim

Park

Kim

et al. 2023

JMMP

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In this paper, a void closure model applicable to the general hot forming process has been proposed. Through the representative volume element (RVE) method, the influences of void shape, orientation, and stress state on void closure tendency were analysed. The void closure model was established so that it could consider these cross effects. The model calculates the changing void radius and orientation during deformation by considering the rate of change of the parameters affecting void deformation with respect to the effective strain. The model predicted the void closure tendency well on the RVE scale and predicted the void closure adequately in a multi-stage process with random voids. The results were compared with the stress-triaxiality-based (STB) model, which showed that the void closure model proposed in this study is applicable in general situations. A cogging process was analysed, and the degree of void closure at the end of each pass was compared with the calculated results of the void closure model. For the experimental verification of the proposed model, spherical and ellipsoid voids were placed in a rectangular specimen, and the radii of the voids after compression were measured. The measurement results were compared with the calculation results of the proposed model.

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“…Chbihi et al (2017) studied pore closure using FE simulations, they concluded that at low triaxiality, high values of the Lode parameter foster pore closure. More recently, Zhang et al (2020) and Wang and Dong (2020) proposed two new prediction models of pore closure that incorporate the Lode parameter.…”

Section: Numerical Simulationsmentioning

confidence: 99%

Pore closure in thick aluminum plate: From industrial hot rolling to individual pore observation

Gravier

Mas

Barthelemy

et al. 2022

Journal of Materials Processing Technology

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A porosity closure model considering stress triaxiality ratio and Lode stress parameter

Cited by 10 publications

References 15 publications

A Study of Interface Bond Strength Following Hot Deformation Bonding of AA6061 at Different Temperatures and Loading Rates

A Study of Interface Bond Strength Following Hot Deformation Bonding of AA6061 at Different Temperatures and Loading Rates

A Geometry-Dependent Void Closure Model Considering Void Deformation and Orientation Changes during Hot Metal Formation

Pore closure in thick aluminum plate: From industrial hot rolling to individual pore observation

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