A practical implementation of silicon microchannel coolers for high power chips

Colgan, E. G.; Furman, B. K.; Gaynes, A.; Graham, William P.; LaBianca, N.; Magerlein, J. H.; Polastre, R.; Rothwell, Mary Beth; Bezama, R. J.; Choudhary, R.; Marston, K.; Toy, Hilton; Wakil, J.; Zitz, Jeffrey A.

doi:10.1109/stherm.2005.1412151

Cited by 92 publications

(59 citation statements)

References 6 publications

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“…In the past, heat sinks using plate-fin (Li and Peterson 2006;Lee et al 2005;Qu and Mudawar 2002), strip-fin (Jonsson and Palm 2000;Colgan et al 2005) and pin-fin arrays (Peles et al 2005;Kosar and Peles 2006) were widely used because of their increased heat transfer area and heat transfer coefficient. However, the pumping power required is also increased due to the large pressure drop as fluid across the fin arrays.…”

Section: Introductionmentioning

confidence: 99%

Experimental study of heat sink performance using copper foams fabricated by electroforming

et al. 2009

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In this study, performance of heat sinks using the copper foams as heat-sinking material is investigated experimentally. The copper foam is fabricated by electroforming technique using polymer foam with pre-coated silver film as the precursors. The manufactured copper foams have the porosity, pore density (pore per inch, PPI), permeability and inertial coefficient in the ranges of 0.5-0.8, 10-40, 0.6-2 x 10(-9) m(2) and 1.5-3, respectively. Besides the copper-foam heat sink, performances of single-channel, plate-fin and pin-fin heat sinks are also investigated and compared with copper-foam heat sinks. The experimentally measured results show that the thermal resistances of copper-foam heat sinks are better than the single-channel, plate-fin and pin-fin heat sinks because of special flow features inside the porous media, enlarged heat-transfer area and enhanced heat transfer coefficient. Detail comparisons between the results of copper-foam heat sinks indicate that the thermal resistance of copper-foam heat sink decreases with the decrease in porosity and increase in pore density. The pressure drop crossing the copper-foam heat sink increases with the increase in pore density and decrease in porosity

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Section: Introductionmentioning

confidence: 99%

Experimental study of heat sink performance using copper foams fabricated by electroforming

et al. 2009

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“…Recently, several studies of microchannel liquid cooling at a chip level have been introduced (Colgan et al 2005;Khan et al 2013;Bakir et al 2008). In terms of cooling capability, direct liquid cooling at the chip level has been found to be significantly more effective than any indirect liquid cooling at the package level.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application

Park

Kim

2016

Microsyst Technol

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“…Recently, the semiconductor industry has started to seriously consider microchannel cooling with liquid as the coolant (Chang et al 2005;Colgan et al 2005), due to the increase in total power generated by the microprocessor and also due to the presence of multiple hotspots. Because to a certain extent, the heat transfer capability of cooling system is dependent on the properties of working fluid.…”

Section: Introductionmentioning

confidence: 99%

Computational fluid dynamics for effects of coolants on on-chip cooling capability with carbon nanotube micro-fin architectures

et al. 2008

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Carbon nanotubes (CNTs) have shown a broad promising application in high mechanical strength and electronic structure. In this work, the effects of coolants on heat transfer capability of on-chip cooling with CNTs Microfin Architectures was studied, and the two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The results demonstrate that pressure drop between the inlet and outlet of the cooling device is dependent on coolant's density and viscosity. Consequently, it will be necessary to find out a good balance between heat transfer capability and pressure drop. The simulation results also indicate that the heat sink capability will be better if there are more fin rows in the microchannel.

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A practical implementation of silicon microchannel coolers for high power chips

Cited by 92 publications

References 6 publications

Experimental study of heat sink performance using copper foams fabricated by electroforming

Experimental study of heat sink performance using copper foams fabricated by electroforming

Evaluation of Si liquid cooling structure with microchannel and TSV for 3D application

Computational fluid dynamics for effects of coolants on on-chip cooling capability with carbon nanotube micro-fin architectures

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