Proceeding of 5th Thermal and Fluids Engineering Conference (TFEC) 2020
DOI: 10.1615/tfec2020.boi.032028
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A Predictive Model for Boiling Heat Transfer Coefficient of Dielectric Fluids on Metal Foams

Abstract: Pool boiling is a suitable technique for direct immersion cooling in electronic devices coupled with dielectric fluids. However, these fluids have relatively poor thermophysical properties in contrast to water, and extremely small contact angle that causes temperature overshooting at the boiling incipience. So, the use of surface enhancement techniques such as porous surfaces has been widely reported to enhance heat transfer performance and meet the cooling requirements. The porous thickness and pore size are … Show more

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