A predictive model for the thermal contact resistance at liquid–solid interfaces: Analytical developments and validation

Hamasaiid, Anwar; Dargusch, Matthew S.; Loulou, Tahar; Dour, Gilles

doi:10.1016/j.ijthermalsci.2011.02.016

Cited by 40 publications

(16 citation statements)

References 59 publications

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“…Models based on stochastic treatments of asperities have been developed by Mikić [12,13] and take the interface deformation into account. For lubricated contacts on can mention more recent models developed by Hamasaiid et al [14] and Yuan et al [15] giving analytical predictions of thermal contact resistance at liquid-solid interfaces. Most models have been validated experimentally for low contact pressures, Fieberg and Kneer [16] proposed an experimental setup in order to measure thermal contact resistance under higher pressure and temperature conditions.…”

Section: Thermal Contact Resistancementioning

confidence: 99%

Coupled heat conduction and multiphase change problem accounting for thermal contact resistance

Weisz-Patrault

2017

International Journal of Heat and Mass Transfer

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International audienceIn this paper, heat conduction coupled with multiphase changes are considered in a cylindrical multilayer composite accounting for thermal contact resistance depending on contact pressures and roughness parameters. A numerical simulation is proposed using both analytical developments and numerical computations. The presented modeling strategy relies on an algorithm that alternates between heat conduction accounting for volumetric heat sources and a multi-phase change model based on non-isothermal Avrami's equation using the isokinetic assumption. Applications to coiling process (winding of a steel strip on itself) are considered. Indeed, phase changes determine the microstructure of the final material and are responsible for residual stresses that create flatness defects. A Finite Element modeling is used for validating the presented solution and numerical results are presented and discussed

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Section: Thermal Contact Resistancementioning

confidence: 99%

Coupled heat conduction and multiphase change problem accounting for thermal contact resistance

Weisz-Patrault

2017

International Journal of Heat and Mass Transfer

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“…Hamasaiid et al [142,143] developed a predictive model for the casting-die interface. The advantages of this model are assuming that the heights of asperity follow a Gaussian distribution which is more acceptable for describing the surface topography [113], and using a parameter, mean asperity peak spacing (Rsm), as the spacing of the peaks and valleys.…”

Section: Thermal Resistance Of Thermal Interface Materials (Tim) and Imentioning

confidence: 99%

“…Fig. 26(a) schematically presents the profile of the liquid-solid interface based on the topographic assumption of Hamasaiid's model [143]. Based on the definition of Rc in the CMY model [113], the authors expressed Rc as function of the effective thermal conductivity of the contacting bodies ks, mean asperity peak spacing (Rsm), root-mean-square deviation of the profile(σ) and the height of entrapped air (Y) between the liquid and solid surfaces: (5) In the model, Y is found to influence Rc strongly and determined by the mechanical analysis.…”

Section: Thermal Resistance Of Thermal Interface Materials (Tim) and Imentioning

confidence: 99%

Heat and fluid flow in high-power LED packaging and applications

Luo

Qiu

Liu

et al. 2016

Progress in Energy and Combustion Science

412

121

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Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are generated from LED chips and then transmitted or conducted through multiple packaging materials and interfaces. Part of the transmitted light converts into heat along the light propagation; in return, the accumulation of heat leads to the degradation of light output. The accumulated heat negatively influences the reliability and longevity of LEDs, and thus thermal management is critical for LED packaging and applications. On the other hand, in LED packaging processes, many fluid flow problems exist, such as phosphor coating, silicone injection, chip bonding, solder reflow, etc. Amongst them, phosphor coating is the most important process which is essential for LED performance. Phosphor gel is a kind of non-Newton fluid and its coating process is a typical fluid-flow problem. Overall, since LED packaging and applications present many heat and fluid flow problems, obtaining a full understanding of these problems enables advancements in the development of LED processes and designs. In this review, the emphasis is placed on heat generation in chips, heat flow in packages and application products, fluid flow in phosphor coating process, etc. This is a domain in which significant progress has been achieved in the last decade, and reporting on these advances will facilitate state-of-the-art LED packaging and application technologies.

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“…Furthermore, the influence of centimeterscale undulations on h c was simulated with several types of fluids [13,14]. A predictive model was proposed for thermal contact resistance formed at the boundary between liquid and solid phases during die-casting, and was examined in comparison with experimental analysis about convection traps [16]. Topographical effect on convective heat transfer in natural convection was found using numerical simulation by the domain decomposition method [17].…”

Section: Introductionmentioning

confidence: 99%

Meso-scale wrinkled coatings to improve heat transfers of surfaces facing ambient air

Kakiuchida

Tajiri

Tazawa

et al. 2015

Applied Thermal Engineering

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A predictive model for the thermal contact resistance at liquid–solid interfaces: Analytical developments and validation

Cited by 40 publications

References 59 publications

Coupled heat conduction and multiphase change problem accounting for thermal contact resistance

Coupled heat conduction and multiphase change problem accounting for thermal contact resistance

Heat and fluid flow in high-power LED packaging and applications

Meso-scale wrinkled coatings to improve heat transfers of surfaces facing ambient air

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