2016
DOI: 10.1109/lpt.2015.2496912
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A Record 1-km MMF NRZ 25.78-Gb/s Error-Free Link Using a 1060-nm DIC VCSEL

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Cited by 27 publications
(9 citation statements)
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“…At this wavelength, fiber chromatic dispersion is one-third and attenuation is half compared to 850 nm [2]. Furukawa has demonstrated 20 GHz bandwidth oxide-confined 1060 nm MM VCSELs with double intra-cavity contacts and a dielectric top distributed Bragg reflector (DBR), enabling 25 Gbps OOK-NRZ transmission over 1 km of 1060 nm optimized MMF [10]. With VCSELs from Furukawa, Georgia Tech demonstrated 50 Gbps PAM-4 transmission over 300 m of wideband MMF using preemphasis and forward error correction (FEC) [11].…”
mentioning
confidence: 99%
“…At this wavelength, fiber chromatic dispersion is one-third and attenuation is half compared to 850 nm [2]. Furukawa has demonstrated 20 GHz bandwidth oxide-confined 1060 nm MM VCSELs with double intra-cavity contacts and a dielectric top distributed Bragg reflector (DBR), enabling 25 Gbps OOK-NRZ transmission over 1 km of 1060 nm optimized MMF [10]. With VCSELs from Furukawa, Georgia Tech demonstrated 50 Gbps PAM-4 transmission over 300 m of wideband MMF using preemphasis and forward error correction (FEC) [11].…”
mentioning
confidence: 99%
“…Transitioning from 850 to 1060 nm leads to a 50% reduction of fibre attenuation and a 70% reduction of chromatic dispersion [7]. This has led to demonstrations of MMF links with capacities of 25 Gbit/s NRZ‐OOK over 1000 m [8] and 50 Gbit/s 4‐PAM over 310 m [9].…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, optical interconnects have the advantage that high-speed signals can be transmitted further than in an electrical one with low propagation loss. Therefore, as the optical interconnects for rack-to-rack data transmission, active optical cables (AOCs) have been developed and widely applied [2][3][4][5][6]. More recently, for high-density signal transmission, it has become necessary to increase the total input/output (I/O) capacity.…”
Section: Introductionmentioning
confidence: 99%
“…Thermal vias are fabricated through the substrate to the bottom of the ICs. In the case of a conventional AOC, the ICs (the VCSEL driver and the TIA) are mounted on the top side of the substrate [3][4][5][6]. On the contrary, the ICs of the proposed AOC are mounted on the bottom side of the substrate.…”
Section: Introductionmentioning
confidence: 99%