enhanced dielectric properties, [2] but polymers are characterized by flexibility, easy processing, and low cost compared to dielectric ceramics. [3] Therefore, the combination of high-dielectric polymers and ceramics is a suitable approach to take advantage of the main characteristics of each constituent, [2a,4] leading to a new generation of materials for sensors, [1b,1c] capacitors, and electronic components [1a,5] or medical devices, [3,5] among others.The energy density, U ¼ 1=2ε 0 Â ε 0 Â E 2 , of flexible polymer-based materials can be optimized by using high-dielectric breakdown strength, E, polymers (about some MV/m), combined with high-dielectric constant ceramics. [4,6] Thus, the key issue in preparing high-performance polymer composites is the selection of the host polymer and the dielectric ceramic, together with the processing that allows processing scalability.