A reliability-driven placement procedure based on thermal-force model

Lee, Jing

doi:10.1016/j.microrel.2005.04.015

Cited by 6 publications

(5 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These are used in conduction simulation on the board with FEM. Many different types of thermal criteria to predict junction temperatures to prevent component failure have been tried [1]. The objective in our case is to make both maximum temperature and temperature difference between components as small as possible and also minimize the total wiring length.…”

Section: Component Placement In a Mobile Phonementioning

confidence: 99%

Optimum geometry of some heat exchangers

Karvinen

2024

J. Phys.: Conf. Ser.

View full text Add to dashboard Cite

Heat exchangers are present in our daily living and industrial applications. The size scale of heat exchangers is very large ranging from very small chips in electronics to huge equipment in process and energy industry. In the paper optimization approaches of some industrial examples are given. The goal is to present how analytical results can and must be used in multi-objective optimization of applications. The details of equations are not given due to page limits but they are found in the literature. The main goal is to show how numerical, analytical and optimization methods can be and must be combined in optimization of exchanger design and performance. The performance depends on very many factors and contradictory requirements must take into account such as maximization of heat transfer and simultaneously minimize for example the weight and size. Modifications of four existing applications are component placement on a wiring board, optimization of heat sink in power electronics, quality control in a glass tempering and optimization of a very huge heat exchanger called economizer in a recovery boiler.

show abstract

Section: Component Placement In a Mobile Phonementioning

confidence: 99%

Optimum geometry of some heat exchangers

Karvinen

2024

J. Phys.: Conf. Ser.

View full text Add to dashboard Cite

show abstract

“…The ant colony algorithm is rooted in the natural behavior of ants foraging for food, specifically addressing the shortest path problem they encounter [26,27]. In this algorithm,…”

Section: Establishment Of Ant Colony Optimization Modelmentioning

confidence: 99%

“…The ant colony algorithm is rooted in the natural behavior of ants foraging for food, specifically addressing the shortest path problem they encounter [26,27]. In this algorithm, a collection of ants, functioning as agents, leverages external pheromone cues to collaboratively tackle intricate problems.…”

Section: Establishment Of Ant Colony Optimization Modelmentioning

confidence: 99%

Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout

Sun,

Yang,

Zhu

2023

Technologies

View full text Add to dashboard Cite

The thermal effect and heat dissipation have a significant impact on three-dimensional stacked chips, and the positional layout of the chip’s three-dimensional layout directly affects the internal temperature field. One effective way is to plan the overall layout of three-dimensional integrated circuits by considering the thermal effect and layout utilization. In this paper, an ant colony algorithm is used to search for the most planned paths and achieve the overall layout optimization by considering the effects of power, temperature, and location on the thermal layout and using feedback optimization of pheromone concentration. The simulation results show that the optimization of the thermal layout of 3D integrated circuits can be well realized by adjusting the algorithm parameters. The maximum temperature, temperature gradient, and layout scheme verify reliability and practicability. It improves the utilization rate of chips, optimizes the layout, realizes energy conservation, and reduces resource waste.

show abstract

“…As a simulation MCM model, IBM TCM (Thermal Conduction Module) is selected for comparing simulation results with the Lee's results [6]. Cooled by thermal conduction, the TCM in the IBM Enterprise System/9000 contains the contacting pistons and a multilayer substrate with 100 cells mounted on one side and I/O pins attached on the other side.…”

Section: Thermal Modelmentioning

confidence: 99%

Cell placement of MCM for reliability optimization

Kim

2010

IEICE Electron. Express

View full text Add to dashboard Cite

Since modern MCM (Multi Chip Module) is required to provide higher performance, MCM's density and power consumption has been increased very rapidly. Increase of chip density and power consumption lead to hot spots which accelerate the device's life time and result in device failure in the long run. In this paper, a new placement method is presented to improve the MCM's reliability using a TPSA (Two-Phase Simulated Annealing) algorithm. The TPSA searches the lowest failure rate placement of MCM perturbing higher failure rate phase and lower failure rate phase at the same time to generate a new movement. The proposed algorithm is applied to the IBM (International Business Machines) MCM device for searching an optimal solution and for comparing optimized results with other optimization results. The result shows improvement in reliability and temperature distribution satisfying constraints.

show abstract

A reliability-driven placement procedure based on thermal-force model

Cited by 6 publications

References 25 publications

Optimum geometry of some heat exchangers

Optimum geometry of some heat exchangers

Ant Colony Algorithm for Energy Saving to Optimize Three-Dimensional Bonding Chips’ Thermal Layout

Cell placement of MCM for reliability optimization

Contact Info

Product

Resources

About