A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

Herkommer, D.; Punch, Jeff; Reid, M.

doi:10.1016/j.microrel.2009.08.008

Cited by 50 publications

(14 citation statements)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…(4,5,7), the approximate probability density function for inelastic shear strain can be derived as very close to the exact one. According to the central limit theorem, the more random variables involved, the more accurate the results.…”

Section: Validation and Analysismentioning

confidence: 59%

“…Thermal fatigue is a very common failure mode of solder joints in electronic components. 3,4 Numerous studies of the reliability of solder joints have been performed. [5][6][7] Most life prediction models require the determination of the stress and strain fields in solder and estimate lifetime by substituting the inelastic strain or inelastic strain energy density into certain empirical formula such as the CoffinManson model.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

Wei

Wang

2011

Journal of Elec Materi

View full text Add to dashboard Cite

Numerous studies of the reliability of solder joints have been performed. Most life prediction models are limited to a deterministic approach. However, manufacturing induces uncertainty in the geometry parameters of solder joints, and the environmental temperature varies widely due to end-user diversity, creating uncertainties in the reliability of solder joints. In this study, a methodology for accounting for variation in the lifetime prediction for lead-free solder joints of ball grid array packages (PBGA) is demonstrated. The key aspects of the solder joint parameters and the cyclic temperature range related to reliability are involved. Probabilistic solutions of the inelastic strain range and thermal fatigue life based on the Engelmaier model are developed to determine the probability of solder joint failure. The results indicate that the standard deviation increases significantly when more random variations are involved. Using the probabilistic method, the influence of each variable on the thermal fatigue life is quantified. This information can be used to optimize product design and process validation acceptance criteria. The probabilistic approach creates the opportunity to identify the root causes of failed samples from product fatigue tests and field returns. The method can be applied to better understand how variation affects parameters of interest in an electronic package design with area array interconnections.

show abstract

Section: Validation and Analysismentioning

confidence: 59%

Section: Introductionmentioning

confidence: 99%

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

Wei

Wang

2011

Journal of Elec Materi

View full text Add to dashboard Cite

show abstract

“…The higher stress, strain and strain energy are concentrated in the SiC die-attach solder layer, in the corners of the die, under the same junction temperature profile. The higher stresses suggest a lower lifetime for the SiC device and a model for predicting the lifetime using simulated data where the "creep strain" is used as a degradation indicator as given by equations (1) and (2) [4].…”

Section: Power Cycling and Stress Mappingmentioning

confidence: 99%

Enabling high reliability power modules: A multidisciplinary task

Gonzalez

Soli

et al. 2016

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3d-Peim)

View full text Add to dashboard Cite

“…Hypoeutectic Sn-3.0Ag-0.5Cu (wt%, SAC305) solder is one type among the SAC solder family which has been widely applied in the commercial microelectronic industry, due to cost considerations, compared to the higher silver composition (Sn-4.0Ag-0.5Cu) [8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

Wang¹,

Wang²,

Feng³

et al. 2012

Materials Science and Engineering: A

View full text Add to dashboard Cite

A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions

Cited by 50 publications

References 14 publications

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

A Probabilistic Approach to Predict Thermal Fatigue Life for Ball Grid Array Solder Joints

Enabling high reliability power modules: A multidisciplinary task

In-situ observation of fracture behavior of Sn–3.0Ag–0.5Cu lead-free solder during three-point bending tests in ESEM

Contact Info

Product

Resources

About