A replication process of metallic micro-mold by using parylene embossing and electroplating

Youn, Sung-Won; Okuno, Hiroshi G.; Takahashi, Masaharu; Oyama, Shoji; Oshinomi, Yasuhiko; Matsutani, Kinya; Maeda, Ryutaro

doi:10.1016/j.mee.2007.05.005

Cited by 21 publications

(14 citation statements)

References 19 publications

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“…This technique can accelerate the speed in the development of a new element with high‐aspect‐ratio microstructures using dicing technology and rapid tooling technique . It can be concluded that the advantages of this study include mold with higher aspect ratio compared to the techniques proposed by Wang et al , capability for batch production of microelements, simple manufacturing process, short fabrication time, and low manufacturing costs compared to the technologies proposed by Youn et al .…”

Section: Resultsmentioning

confidence: 91%

Manufacturing process development of a precision rapid tooling with high‐aspect‐ratio micro‐sized features

Kuo

Zhuang

2016

Materialwissenschaft Werkst

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The high-aspect-ratio elements are widely employed for chemical sensors, microfluidics and medical imaging devices. To enhance the competitiveness in the market of elements with high-aspect-ratio microstructures, a cost-effective method for fabricating molds with high-aspect-ratio microstructures was proposed. In order to manufacture the second rubber mold, low-temperature plasma were used to change the surface characteristics of the rubber mold to avoid using the release agents in the manufacturing process. It was found that the aluminum (Al)-filled epoxy resin mold with the aspect ratio of 20 : 1 can be carried out in about three days. Replication rates of a precision rapid tooling with high-aspect-ratio micro-sized features around 97 % can be obtained. The total fabrication cost savings for fabricating a SU-8 microelement with the aspect ratio of 20 : 1 about 71 % can be obtained.

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Section: Resultsmentioning

confidence: 91%

Manufacturing process development of a precision rapid tooling with high‐aspect‐ratio micro‐sized features

Kuo

Zhuang

2016

Materialwissenschaft Werkst

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“…It is a chemically stable, USP (United States Pharmacopeia) Class VI biocompatible, and flexible material that has been widely implemented in microfluidics and bioMEMS applications such as microvalves [ 1 ], accelerometers [ 2 ], flexible electrodes [ 3 , 4 ], and neural probes [ 5 , 6 , 7 ]. To pattern the Parylene C, different fabrication techniques have been proposed, such as wet etching using chloronapthelene or benzoyl benzoate [ 8 ], dry etching based on O 2 plasma [ 9 , 10 , 11 , 12 , 13 , 14 , 15 ], thermal imprinting or micro-molding [ 16 , 17 ] and laser micromachining [ 18 , 19 , 20 ]. Among the existing fabrication strategies, the dry etching technique is a relatively clean and effective method that is suitable for batch fabrication of Parylene C microstructures.…”

Section: Introductionmentioning

confidence: 99%

SF6 Optimized O2 Plasma Etching of Parylene C

Zhang

Liu

et al. 2018

Micromachines

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Parylene C is a widely used polymer material in microfabrication because of its excellent properties such as chemical inertness, biocompatibility and flexibility. It has been commonly adopted as a structural material for a variety of microfluidics and bio-MEMS (micro-electro-mechanical system) applications. However, it is still difficult to achieve a controllable Parylene C pattern, especially on film thicker than a couple of micrometers. Here, we proposed an SF6 optimized O2 plasma etching (SOOE) of Parylene C, with titanium as the etching mask. Without the SF6, noticeable nanoforest residuals were found on the O2 plasma etched Parylene C film, which was supposed to arise from the micro-masking effect of the sputtered titanium metal mask. By introducing a 5-sccm SF6 flow, the residuals were effectively removed during the O2 plasma etching. This optimized etching strategy achieved a 10 μm-thick Parylene C etching with the feature size down to 2 μm. The advanced SOOE recipes will further facilitate the controllable fabrication of Parylene C microstructures for broader applications.

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“…Some of them are already commonly used for fabrication of miniaturized systems such as fluorocarbon-based polymers, 8-10 SU-8, 12 benzocyclobutene (BCB), [12][13][14][15] polyimide, 13 and parylene. [16][17][18][19][20] Epoxy-glue, 21 Hysol, 22 parylene 23,24 or PDMS 25 have for instance been used for bonding silicon to parylene, silicon to silicon and glass and PDMS substrates, respectively. These materials are cured with a thermal process.…”

Section: Introductionmentioning

confidence: 99%

Low-temperature, simple and fast integration technique of microfluidic chips by using a UV-curable adhesive

2010

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In the fields of MicroElectroMechanical Systems (MEMS) and Lab On a Chip (LOC), a device is often fabricated using diverse substrates which are processed separately and finally assembled together using a bonding process to yield the final device. Here we describe and demonstrate a novel straightforward, rapid and low-temperature bonding technique for the assembly of complete microfluidic devices, at the chip level, by employing an intermediate layer of gluing material. This technique is applicable to a great variety of materials (e.g., glass, SU-8, parylene, UV-curable adhesive) as demonstrated here when using NOA 81 as gluing material. Bonding is firstly characterized in terms of homogeneity and thickness of the gluing layer. Following this, we verified the resistance of the adhesive layer to various organic solvents, acids, bases and conventional buffers. Finally, the assembled devices are successfully utilized for fluidic experiments.

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A replication process of metallic micro-mold by using parylene embossing and electroplating

Cited by 21 publications

References 19 publications

Manufacturing process development of a precision rapid tooling with high‐aspect‐ratio micro‐sized features

Manufacturing process development of a precision rapid tooling with high‐aspect‐ratio micro‐sized features

SF6 Optimized O2 Plasma Etching of Parylene C

Low-temperature, simple and fast integration technique of microfluidic chips by using a UV-curable adhesive

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