2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) 2015
DOI: 10.1109/siitme.2015.7342302
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A research of the characteristics of materials used in the construction of EDLCs

Rodica Negroiu
1
,
N. Badalan
2
,
Al. Vasile
3
et al.
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