A Review of Low-Temperature Solders in Microelectronics Packaging

Jayaram, Vidya; Gupte, Omkar; Bhangaonkar, Karan; Nair, Chandrasekharan

doi:10.1109/tcpmt.2023.3271269

Cited by 17 publications

(2 citation statements)

References 82 publications

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“…One of the distinct differences in material compounds in advanced packages is the transition to low-temperature solders (LTS) such as Sn–Bi and In-based solders. LTSs, having a lower melting temperature than their SAC counterparts, mitigate warpage during the board-attach reflow process [ 107 ]. Another concern in high reflow temperatures is delamination in hybrid bonds between different tiers [ 108 ].…”

Section: Latest Reliability Testing Studies On Advanced Package Assem...mentioning

confidence: 99%

Modern Trends in Microelectronics Packaging Reliability Testing

Bender,

Bernstein,

Boning

2024

Micromachines

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In this review, recent trends in microelectronics packaging reliability are summarized. We review the technology from early packaging concepts, including wire bond and BGA, to advanced techniques used in HI schemes such as 3D stacking, interposers, fan-out packaging, and more recently developed silicon interconnect fabric integration. This review includes approaches for both design modification studies and packaged device validation. Methods are explored for compatibility in new complex packaging assemblies. Suggestions are proposed for optimizations of the testing practices to account for the challenges anticipated in upcoming HI packaging schemes.

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Section: Latest Reliability Testing Studies On Advanced Package Assem...mentioning

confidence: 99%

Modern Trends in Microelectronics Packaging Reliability Testing

Bender,

Bernstein,

Boning

2024

Micromachines

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“…Given that the bonding temperature of the SLID system is directly linked to the melting point of the low-temperature metal [21], one potential approach is to replace Sn with low-temperature alloyed Sn to reduce the Cu-Sn SLID bonding temperature. In the development of lead-free solders, Bi, In, and Zn were found to be the most feasible alloying elements for Sn, effectively lowering the melting point of Sn [14], [22], [23], [24], [25]. Nevertheless, it has been found that Sn-Zn solders exhibit poor wettability and corrosion resistance [22], [26], [27], [28], while Sn-Bi solders suffer from low wettability and brittleness due to the inherent nature of bismuth [14], [29], [30], [31].…”

Section: Introductionmentioning

confidence: 99%

Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability

Emadi,

Vuorinen,

Liu

et al. 2024

Preprint

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In response to the evolving demands of microelectromechanical system (MEMS) integration, aiming to achieve high-performance electronic products, innovative interconnect solutions are becoming essential. The interconnects must possess key features, including the capability for miniaturization, low processing temperatures, and the ability to maintain a stable microstructure with optimized electrical, mechanical, and thermomechanical properties. To meet these demands, this study designed a novel Cu-Sn-based solid-liquid interdiffusion (SLID) interconnect. The study involved the implementation of a metallization stack, incorporating Co as a layer to interact with low-temperature Cu-Sn-In SLID and form intermetallic compounds (IMCs). Since Cu6(Sn,In)5 forms at a lower bonding temperature than other phases commonly observed in the Cu-Sn-In system, the study aimed to develop interconnects comprising a stable single-phase (Cu,Co)6(Sn,In)5. Bonding conditions were established for the Cu-Sn-In/Co system and the Cu-Sn/Co system as a reference. Thorough assessments of their thermomechanical reliability were conducted through hightemperature storage (HTS), thermal shock (TS), and tensile tests. The Cu-Sn-In/Co system emerged as a reliable low-temperature solution with the following key attributes: 1) a reduced bonding temperature compared to the Cu-Sn SLID interconnects, 2) the absence of the Cu3Sn phase and resulting void-free interconnects, and 3) high thermomechanical reliability, particularly following thermal annealing after bonding.

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Resource-Saving Environmentally Friendly Technology for Small-Scale Production of Lead-Free Solder

Radionova,

Faizov

2024

Springer Proceedings in Earth and Environmental Sciences

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A Review of Low-Temperature Solders in Microelectronics Packaging

Cited by 17 publications

References 82 publications

Modern Trends in Microelectronics Packaging Reliability Testing

Modern Trends in Microelectronics Packaging Reliability Testing

Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability

Resource-Saving Environmentally Friendly Technology for Small-Scale Production of Lead-Free Solder

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