A review of on-chip micro-evaporation: Experimental evaluation of liquid pumping and vapor compression driven cooling systems and control

Energy efficient hotspot-targeted embedded liquid cooling of electronics

“…However, the inability to follow the Dennard supply voltage has lead to high chip heat flux dissipation densities, especially during the last decade [2]. As a consequence, electronic reliability considerations are driving a shift away from air-cooling [3] towards a number of alternative approaches including liquid cooling [4,5], two-phase cooling [6,7], phase change materials (PCM) [8,9] and nanofluids [10,11]. Single-phase liquid cooling has long been identified as an effective and feasible approach for cooling high heat flux density chips.…”

Dryout avoidance control for multi-evaporator vapor compression cycle cooling

“…Using a large heat spreader [8] may not be suitable for electronics systems with size or weight constraints. Overfeeding the evaporators with refrigerant can provide a large CHF safety factor [7,[11][12][13], but the higher flow rates increase power consumption by pumps or compressors. Furthermore, there lacks systematic design approach to address the inherent nonlinearity of CHF.…”

“…Current strategies for CHF avoidance in active two-phase cooling of electronics include heat-spreaders or cold-plates to enhance heat transfer and lower heat flux [7][8][9][10][11][12][13][14], setting low evaporator outlet quality setpoints to maintain a large CHF safety factor [7,[11][12][13][14], and CHF avoidance control using wall temperature feedback proposed by our group [15][16][17][18]. Several experimental electronics cooling studies that implement these techniques are summarized in Table 1, with representative test section conditions reported.…”

On-chip two-phase cooling of datacenters: Cooling system and energy recovery evaluation

“…It avoids potential problems of mal-distribution in each ME line due to non-uniform heat load on the microprocessors and bad pipeline designs. Preliminary experimental evaluation can be found in [30]; where one SMV controlling the mixture (junction of piping) outlet vapor quality of two MEs proved to be feasible and efficient. c) Micro-evaporator (ME): transfers the heat generated by the microprocessor to the refrigerant.…”