2012
DOI: 10.1093/ijlct/cts021
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A review of PCM technology for thermal energy storage in the built environment: Part I

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Cited by 69 publications
(27 citation statements)
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“…Here based on the given temperature, an organic PCM (Methyl Eicosanate) was considered most appropriate. Organic PCMs are the most viable latent heat storage materials due to their long‐term stability . The thermal properties of PCMs are presented in Table .…”
Section: Resultsmentioning
confidence: 99%
“…Here based on the given temperature, an organic PCM (Methyl Eicosanate) was considered most appropriate. Organic PCMs are the most viable latent heat storage materials due to their long‐term stability . The thermal properties of PCMs are presented in Table .…”
Section: Resultsmentioning
confidence: 99%
“…Referring to the melting temperature, materials with a melting/freezing temperature between 18 °C and 40 °C are particularly suitable as PCM for building applications; this range of temperatures is, in fact, considered to be an optimum. According to the literature, the temperature of phase transition of the selected PCM should be very close to the human comfort temperatures (i.e., 22–26 °C) [22,23]. Nevertheless, PCMs that fall within three temperature ranges have been suggested for use in buildings [16]: Up to 21 °C for cooling applications;From 22 °C to 28 °C for optimal human comfort;From 29 °C to 60 °C for hot water applications, such as in the case of radiant floors often using water combined with PCMs.…”
Section: Classification Of Pcmsmentioning
confidence: 99%
“…An example of incorporating PCMs in an active system is radiant floors [5]. These systems consist of a lightweight piped radiant floor, where an integrated PCM layer is aimed at buffering internal gains during the summer season without affecting the winter warming capacity [22].…”
Section: Pcms In Building Materialsmentioning
confidence: 99%
“…PCMs are divided into organic, inorganic and eutectics compounds [1]. However, utilizing bulk quantities of organic PCMs such as paraffin or fatty acids results in low thermal conductivity, flammability, solidification around the edges, and diminished heat transfer [2,3]. In order to solve these problems, microencapsulation can be employed.…”
Section: Graphic Abstract Introductionmentioning
confidence: 99%