A review of plastic-encapsulated-microcircuit reliability-prediction models

Mok, Y. R.; Ten, Lin-Mei

doi:10.1109/rams.2000.816307

Annual Reliability and Maintainability Symposium. 2000 Proceedings. International Symposium on Product Quality and Integrity (C

DOI: 10.1109/rams.2000.816307

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A review of plastic-encapsulated-microcircuit reliability-prediction models

Y. R. Mok

Lin-Mei Ten²

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The popcorn effect of lead and lead-free mixed assembly process in high density plastic packages

Hong

Peng

2011

2011 International Symposium on Advanced Packaging Materials (APM)

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The expansion of integrated circuit applications is driving chip costs down. To respond to the lower price the lower price expectations, manufacturers bring Plastic packages which is cost less expensive packaging solutions. Today although the electronic packaging industry there are still many enterprises were to have lead solder, but this does not preclude the "lead-free" has become the main topic of electronic materials and microelectronics. In this transitional period, lead and lead-free both assemble on the plastic package in the field of application is already unavoidable. Problem existed in lead or lead-free materials, technology, equipment, system compatibility and other issues.

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The popcorn effect of lead and lead-free mixed assembly process in high density plastic packages

Hong

Peng

2011

2011 International Symposium on Advanced Packaging Materials (APM)

View full text Add to dashboard Cite

show abstract

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A review of plastic-encapsulated-microcircuit reliability-prediction models

Cited by 1 publication

References 10 publications

The popcorn effect of lead and lead-free mixed assembly process in high density plastic packages

The popcorn effect of lead and lead-free mixed assembly process in high density plastic packages

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