A review of reliability prediction methods for electronic devices

Foucher, B.; Boullié, J; Meslet, B; Das, Diganta

doi:10.1016/s0026-2714(02)00087-2

Cited by 94 publications

(42 citation statements)

References 9 publications

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“…The first field data method for predicting electronic equipment reliability was documented in a 1999 paper on the HIRAP (Honeywell In-service Reliability Assessment Program) method, which was created in-house by Honeywell inc [20]. The benefits of the field data method over handbook methods are significant, in fact many similar methods have recently surfaced (REMM and TRACS [17] as well as FIDES [16]). The field data method answers the handbook methods inability to satisfactorily incorporate board-layout and operating environment into the reliability estimate.…”

Section: Evolution Of Reliability Prediction Methodsmentioning

confidence: 99%

“…Handbook methods are relatively simple to implement, in that they do not require complex mathematical modelling, only part types, part counts, application environments and other readily available parameters, these parameters are then input into a model to calculate the MTBF. Despite its advantages Mil-Hdbk-217 is increasingly falling out of favour [12,17,42,50,51], a non-exhaustive list of the limitations are:…”

Section: Handbook Methodsmentioning

confidence: 99%

“…A possible work-around for this limitation is to implement Highly Accelerated Life Testing (HALT) for the purposes of quickly building a failure rate database, although accurately determining the exact environment is difficult but vital [27] describes the second stage of implementing the field data method, using an example this paper shows how to predict the MTTF for a proposed design, where this design is modified from existing equipment for which detailed failure data exists. Other reviews of field data methods exist by various authors [11,17,20,26].…”

Section: Field Data Methodsmentioning

confidence: 99%

“…Foucher et al [17] follows a similar pattern to the IEEE review, as substantial emphasis is placed on thermal failures. The previous brevity of analysis on PoF methods, especially with reference to shock and vibration failures merits further review into these areas.…”

Section: Introductionmentioning

confidence: 91%

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Reliability Analysis of Electronic Equipment Subjected to Shock and Vibration – A Review

Amy

Aglietti

Richardson

2009

Shock and Vibration

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Abstract. Increasingly modern electronic equipment is expected to provide more functionality whilst still being able to withstand shock and vibration loads. The process of reliability prediction has been hampered by the complicated response and failure characteristics of electronic equipment, with the currently available methods being a compromise between accuracy and cost. A process to quickly and confidently predict the reliability of proposed electronic equipment to dynamic loads would greatly benefit industry. This paper will illustrate the difficulties in predicting electronic equipment reliability, showing why progress has been slow, in addition to the difficulty in making a model that works across a broad range of equipment configurations. The four classes of reliability prediction methods (Handbook, Test data, Field data and Physics of Failure) will be contrasted before addressing the individual methods.It is pertinent to note that although the majority of failures in electronic equipment are due to thermal issues, this review focuses on shock and vibration induced failures.

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Section: Evolution Of Reliability Prediction Methodsmentioning

confidence: 99%

Section: Handbook Methodsmentioning

confidence: 99%

Section: Field Data Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 91%

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Reliability Analysis of Electronic Equipment Subjected to Shock and Vibration – A Review

Amy

Aglietti

Richardson

2009

Shock and Vibration

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“…The reliability of electronic device, as its specific feature, was presented by Fouchera et al [8]. The essence of the wear of objects, by C. Cempel, Natke [9] is an increase in damage and partial defects.…”

Section: Introductionmentioning

confidence: 99%

The Life Cycle of a Building as a Technical Object

Nowogońska

2016

Period. Polytech. Civil Eng.

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In solving problems associated with maintaining buildings in good condition, it is important to recognise the changes in op- IntroductionIn business planning of repairing the buildings one should determine the scope of works. There is no reliable mathematical models that allow the estimation of the operational reliability of a building, often referred to as changes in the building performance. In the case of technical appliances (mechanical and electronic) attempts are undertaken to determine the prediction of their operational reliability, but for buildings -only indicative graphs of changes in performance are presented. The method of behaving and changing the reliability of the building throughout its use will be useful in planning renovations.All appliances are built from parts. Similarly, each building consists of many components. These elements, which fulfil different functions, are made of dissimilar materials, each has different properties, and different durability periods. In order to determine building reliability it is divided into components which are analysed, first separately and then altogether in the entire building. In the process of predicting the reliability of both individual components of a building and a building as a whole, it may be initially assumed that the lifetime of a building is a 100-year time interval.To model a situation for the needs of the survival analysis, when the probability changes in time, the Weibull distribution is most frequently used as a distribution of random variable of the time of the building's usefulness. The probability of the exploitation of a building without any breakdowns in a given period of time is defined as exploitation reliability.

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Physics‐of‐Failure based Reliability Engineering

Quintero

Pecht

2013

Applied Reliability Engineering and Risk Analysis

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With increased use, complexity, and miniaturization of electronics in various applications, there is a need to improve the reliability of electronic products swiftly and cost-effectively. The shift from the use of traditional constant failure rate approaches to estimate the reliability of electronic products was enabled by physics-of-failure based reliability approaches. In a physics-offailure based reliability assessment, the failure mechanisms that degrade products and ultimately produce failures are identified, based on the hardware configuration and anticipated life-cycle profile. Physics-of-failure models associated with specific failure mechanisms are utilized to provide a statistical distribution of the time-to-failure for a particular failure mechanism and site. Physics-of-failure based reliability assessment is integrated into the product development process to aid in design-forreliability, stress test selection, product qualification, product screening, and prognostics and health management. This paper describes various steps involved in the physics-of-failure based reliability of electronic products and its integration into the product development process.

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A review of reliability prediction methods for electronic devices

Cited by 94 publications

References 9 publications

Reliability Analysis of Electronic Equipment Subjected to Shock and Vibration – A Review

Reliability Analysis of Electronic Equipment Subjected to Shock and Vibration – A Review

The Life Cycle of a Building as a Technical Object

Physics‐of‐Failure based Reliability Engineering

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