A Review of Select Patented Technologies for Cooling of High Heat Flux Power Semiconductor Devices

Joshi, Saurabh; Zhu, Feng; Liu, Yanghe; Lohan, Danny J.; Ukegawa, Hiroshi; Lee, Jae; Dede, Ercan M.

doi:10.1109/tpel.2023.3243546

Cited by 22 publications

(3 citation statements)

References 41 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…copper #100 mesh with 0.114 mm wire diameter. [45], [46], [47] Figure 9a shows the values of u𝛿, at maximum driving pressure for dynamic viscosities of 0.469 mPa s (HFO1233zd) and 0.581 mPa s (HFE7100). Due to the lower surface tension of these fluids than DI water at similar temperature, the maximum driving force (pressure difference) we can apply is significantly lower than that of DI water.…”

Section: Flow Performance Of Free-standing Meshesmentioning

confidence: 99%

Permeability of Single-Layer-Free-Standing Meshes at Varying Capillary Pressure via a Novel Method

Shattique¹,

Giglio²,

Dede³

et al. 2023

Preprint

View full text Add to dashboard Cite

The permeability of mesh wicks is important for various applications, for example two-phase heat transfer. However, our understanding of the permeability of single-layer, free-standing mesh wicks (SLFSMW), with liquid-gas interfaces on both sides, is limited. We present a novel and simpler method to determine the permeability of a SLFSMW and apply it to a representative mesh. Our method involves modifying the capillary pressures elevation and simultaneously measuring the permeability to determine the permeability-capillary pressure relationship. When applied to a copper mesh with plain weave having undergone careful surface cleaning, the permeability is found to decrease as capillary pressure for deionized (DI) water increases. We present dimensional analysis to generalize our data for other mesh sizes with similar weaves, and fluids. We model the behavior of mesh in application based on the integration of Darcy’s law with an analytic function fit to measured data and conduct parametric studies to investigate the superficial velocity of liquids through the mesh under varying driving pressures, transport lengths, and liquid viscosity based on the obtained capillary pressure-permeability relationship. This study provides valuable insights into the transport properties of mesh wicks, with potential applications in fields such as electronics cooling, electrochemical devices, and fluid purification technologies.

show abstract

Section: Flow Performance Of Free-standing Meshesmentioning

confidence: 99%

Permeability of Single-Layer-Free-Standing Meshes at Varying Capillary Pressure via a Novel Method

Shattique¹,

Giglio²,

Dede³

et al. 2023

Preprint

View full text Add to dashboard Cite

show abstract

“…(II)'s Equation (SM2), Supporting Information) to evaluate the performance of two common fluids used in electronics cooling applications HFO1233zd (at 25 °C surface tension, 𝜎 = 12.57 mN m −1 and dynamic viscosity, μ = 0.469 mPa s, 𝜃 ≈ 0 0 ) and HFE7100 (at 25 °C surface tension, 𝜎 = 13.345 mN m −1 and dynamic viscosity, μ = 0.58 mPa s, 𝜃 ≈ 0°), in plain weaved single layer copper #100 mesh with 0.114 mm wire diameter. [46][47][48] Figure 9a shows the values of u𝛿, at maximum driving pressure for dynamic viscosities of 0.469 mPa s (HFO1233zd) and 0.581 mPa s (HFE7100). Due to the lower surface tension of these fluids than DI water at similar temperature, the maximum driving force (pressure difference) we can apply is significantly lower than that of DI water.…”

Section: Flow Performance Of Free-standing Meshesmentioning

confidence: 99%

Permeability of Single‐Layer‐Free‐Standing Meshes at Varying Capillary Pressure via a Novel Method

Shattique

Giglio

Dede³

et al. 2023

Adv Materials Inter

Self Cite

View full text Add to dashboard Cite

The permeability of mesh wicks is important for various applications, including two‐phase heat transfer. However, the understanding of the permeability of single‐layer, free‐standing mesh wicks, with liquid–gas interfaces on both sides, is limited. A novel and simpler method is presented to determine the permeability of a free‐standing wick and apply it to a representative mesh. This method involves modifying the capillary pressure via elevation and simultaneously measuring the permeability to determine the permeability‐capillary pressure relationship. When applied to a copper mesh with plain weave having undergone surface cleaning, the permeability is found to decrease as capillary pressure for deionized water increases. A dimensional analysis is presented to generalize this data for other mesh sizes with similar weaves and fluids. The behavior of mesh in application is modeled, based on the integration of Darcy's law with an analytic function fit to measured data, and parametric studies are conducted to investigate the superficial velocity of liquids through the mesh under varying driving pressures, transport lengths, and liquid viscosity, based on the obtained capillary pressure–permeability relationship. This study provides valuable insights into the transport properties of mesh wicks, with potential applications in fields such as electronics cooling, electrochemical devices, and fluid purification technologies.

show abstract

“…This can be achieved using materials with high thermal conductivity to maintain their operational performance and long-term reliability. On the other hand, materials with reduced thermal conductivity are essential for thermoelectric devices, thermal insulators, and even phononic computing devices to ensure a high figure of merit in such applications [4,5].…”

Section: Introductionmentioning

confidence: 99%

A Molecular Dynamics Simulation Study of In- and Cross-Plane Thermal Conductivity of Bilayer Graphene

Mohammadi,

Ghaderi,

Hajian

2023

Materials

View full text Add to dashboard Cite

Efficient thermal management of modern electronics requires the use of thin films with highly anisotropic thermal conductivity. Such films enable the effective dissipation of excess heat along one direction while simultaneously providing thermal insulation along the perpendicular direction. This study employs non-equilibrium molecular dynamics to investigate the thermal conductivity of bilayer graphene (BLG) sheets, examining both in-plane and cross-plane thermal conductivities. The in-plane thermal conductivity of 10 nm × 10 nm BLG with zigzag and armchair edges at room temperature is found to be around 204 W/m·K and 124 W/m·K, respectively. The in-plane thermal conductivity of BLG increases with sheet length. BLG with zigzag edges consistently exhibits 30–40% higher thermal conductivity than BLG with armchair edges. In addition, increasing temperature from 300 K to 600 K decreases the in-plane thermal conductivity of a 10 nm × 10 nm zigzag BLG by about 34%. Similarly, the application of a 12.5% tensile strain induces a 51% reduction in its thermal conductivity compared to the strain-free values. Armchair configurations exhibit similar responses to variations in temperature and strain, but with less sensitivity. Furthermore, the cross-plane thermal conductivity of BLG at 300 K is estimated to be 0.05 W/m·K, significantly lower than the in-plane results. The cross-plane thermal conductance of BLG decreases with increasing temperatures, specifically, at 600 K, its value is almost 16% of that observed at 300 K.

show abstract

A Review of Select Patented Technologies for Cooling of High Heat Flux Power Semiconductor Devices

Cited by 22 publications

References 41 publications

Permeability of Single-Layer-Free-Standing Meshes at Varying Capillary Pressure via a Novel Method

Permeability of Single-Layer-Free-Standing Meshes at Varying Capillary Pressure via a Novel Method

Permeability of Single‐Layer‐Free‐Standing Meshes at Varying Capillary Pressure via a Novel Method

A Molecular Dynamics Simulation Study of In- and Cross-Plane Thermal Conductivity of Bilayer Graphene

Contact Info

Product

Resources

About