1986
DOI: 10.1016/0168-583x(86)90002-9
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A review of the application of analytical electron microscopy to ion-implanted materials

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Cited by 6 publications
(1 citation statement)
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“…[46][47][48] Furthermore, the direct observation of implantation-induced damage and postimplantation microstructural alterations upon thermal annealing have been systematically performed using cross-sectional TEM. [49][50][51] For instance, Mg ion implantation into a GaN epitaxial layer generated point defects and defect complexes, which further developed into extended defects during the post-implantation annealing process. Structural defects such as pyramidal inversion domains and nanoscale extrinsic/intrinsic stacking faults were identified by STEM in Mg-implanted GaN with subsequent annealing.…”
Section: Introductionmentioning
confidence: 99%
“…[46][47][48] Furthermore, the direct observation of implantation-induced damage and postimplantation microstructural alterations upon thermal annealing have been systematically performed using cross-sectional TEM. [49][50][51] For instance, Mg ion implantation into a GaN epitaxial layer generated point defects and defect complexes, which further developed into extended defects during the post-implantation annealing process. Structural defects such as pyramidal inversion domains and nanoscale extrinsic/intrinsic stacking faults were identified by STEM in Mg-implanted GaN with subsequent annealing.…”
Section: Introductionmentioning
confidence: 99%