30th Aerospace Sciences Meeting and Exhibit 1992
DOI: 10.2514/6.1992-709
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A review of the thermal contact conductance of junctions with metallic coatings and films

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Cited by 14 publications
(14 citation statements)
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“…The analysis of heat transfer at the interface is analogous to our problem of mass transport, especially when a convection boundary condition is present at these discrete regions instead of solid-solid contact. Determination of the constriction resistance is important for applications such as microelectronics where junctions are coated with metallic films to reduce the constriction resistance (Lambert & Fletcher 1993).…”
Section: Overview Of Applicationsmentioning
confidence: 99%
“…The analysis of heat transfer at the interface is analogous to our problem of mass transport, especially when a convection boundary condition is present at these discrete regions instead of solid-solid contact. Determination of the constriction resistance is important for applications such as microelectronics where junctions are coated with metallic films to reduce the constriction resistance (Lambert & Fletcher 1993).…”
Section: Overview Of Applicationsmentioning
confidence: 99%
“…A review of literature on the thermal conductance [8][9][10][11][12] has indicated a lack of experimental data of thermal contact resistance and total thermal conductance for honeycomb materials. Most of the previous studies on the thermal transport properties of honeycomb structures were analytically investigated.…”
Section: Introductionmentioning
confidence: 99%
“…Much of this work has been reviewed by Madhusudana [2] and Lambert and Fletcher [3]. Desirable coatings are generally soft, highly conductive metals deposited on one or both contact surfaces.…”
Section: Introductionmentioning
confidence: 99%
“…Commonly studied metals include copper, gold, indium, lead, nickel, silver and tin. Optimum coating thicknesses have been found for each material [2,3]. Most researchers identified the ratio of thermal conductivity to microhardness as the most important factor in affecting the thermal contact conductance.…”
Section: Introductionmentioning
confidence: 99%