A Review on Cooling of Discrete Heated Modules Using Liquid Jet Impingement

Abstract

The manuscript deals with the critical review for cooling of discrete heated electronic components using liquid jet impingement. Cooling of electronic components has been a lead area of research in recent years. Due to the rapid growth of electronic industries, there is an enormous rise in the system power consumption, and the reduction in the size of electronic components has led to a rapid increase in the heat dissipation rate per unit volume of components. The present paper deals with the role of liquid jet impingement (heat flux removal rate 200-600 W/cm 2) for cooling of electronic components. The type of working fluids (Water / Fluorocarbon liquids / Dielectric fluids / Nanofluids) used for cooling, mode of heat transfer (Natural / Forced / Mixed) from electronic components, and the method of analysis (Experimental / Numerical / Combination of both) greatly influence the cooling mechanism. The electronic components considered in the present study are limited to microelectronic chips, VLSI circuit chips, integrated circuits (IC) chips and resistors. Most of the literature is pertinent to cooling of square heat sources, and many of the researchers have also focused on the comparative studies using different working fluids. Results suggest that Fluorocarbon liquids can be used for higher heat flux removal due to their high boiling point. The temperature drop obtained from the electronic components using liquid jet impingement was found to be in the range of 80-85ºC.

Heat Transfer Enhancement in Tubular Heat Exchanger with Jet Impingement: A Review

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Numerical modelling and analysis of porous surface-enhanced jet cooling using copper inverse opals in single-phase flow

“…Single-phase jet impingement has been established as a promising cooling scheme for highly integrated microdevices, based on both numerical and experimental investigations (Brunschwiler et al 2006;Tang et al 2016;Laguna et al 2018;Patil & Hotta, 2018;Wei et al 2019aWei et al ,b, 2020aWei et al ,b, 2022. Due to the thin hydrodynamic and thermal boundary layers generated by the impingement jet, singlephase liquid impingement jet cooling can achieve a much higher heat transfer coefficient (HTC) than conventional cooling schemes, particularly in the stagnation region.…”

Research progress of liquid cooling technology for high heat flux electronic equipment

“…In recent years, with the rapid development of electronics industry, semiconductor technology and micro-assembly ability, high-frequency, high integration and miniaturization have become the development direction of electronic equipment. Heat flux density of electronic equipment has reached and exceeded 100W/cm 2 [1]. The research and application of cooling technology is a complex system work in high heat flow electronic equipment.…”