A review on microwave band pass filters: Materials and design optimization techniques for wireless communication systems

Krishna, Neeraj; Padmasine, K.G.

doi:10.1016/j.mssp.2022.107181

Cited by 28 publications

(5 citation statements)

References 190 publications

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“…The evaluation of thermal performance in electronic systems often relies on simulation techniques supported by specialized preprocessing and postprocessing tools. Finite Element Method (FEM) solvers are extensively utilized for heat transfer analysis [39][40][41]. Figure 10 depicts the temperature outcomes obtained from the model without CCLC.…”

Section: Heat Analysis Of Sips Based On Cclcmentioning

confidence: 99%

Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology

et al. 2023

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This paper introduces a novel approach to address thermal management challenges in system-in-package (SiP) technology, which is a significant concern in various advanced technologies. The main objective is to assess the electrical and thermal performance of the SiP model by utilizing Chip Cooling Laminate Chip (CCLC) technology. To achieve this, we employed finite element method (FEM) analysis using COMSOL Multiphysics® and MATLAB® to compare the results of electrical and thermal SiP models with and without CCLC technology. The numerical simulations revealed that, as opposed to the traditional model, the temperature variation decreased significantly with a uniform temperature distribution when employing the CCLC technology. Additionally, the thermal conduction performance of the packaging system using CCLC demonstrated remarkable reliability and resolution with cost-effective micro-devices, particularly in micro-medicine applications. The analysis of the electrical and thermal models reported a maximum error between them of 1.15 ∘C.

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Section: Heat Analysis Of Sips Based On Cclcmentioning

confidence: 99%

Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology

et al. 2023

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“…To ensure crisp transitions at cutoff frequencies, compactness, high selectivity, low insertion loss, increased fractional bandwidth, and high return loss, the best performance of microwave band pass filters is evaluated using optimization methodologies. A study found that using the correct fabrication techniques and materials increases the performance of microwave bandpass filter designs, making them more useful in the development of wireless communication systems [28]. This research proposes and designs a low-profile and highly selective microstrip band-pass filter for 5G mid-bandfrequency applications that support commercial 5G networks.…”

Section: Introductionmentioning

confidence: 99%

Development of Compact Bandpass Filter Using Symmetrical Metamaterial Structures for GPS, ISM, Wi-MAX, and WLAN Applications

Vineetha,

Madhav,

Kumar

et al. 2023

Symmetry

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This article describes the development of a compact microstrip bandpass filter (BPF) for multiple wireless communication utilizations. The proposed bandpass filter consists of metamaterial unit cells that are symmetrical in shape. The design process involves the placement of four symmetrical split-ring resonators (SRRs) on the top plane of the BPF. It exhibits improved filter characteristics through the implementation of these SRRs. The filter was modeled and fabricated and its performance was evaluated using a Vector Network Analyzer. The designed bandpass filter shows a 5 GHz bandwidth covering the frequency band spanning from 1 to 5.2 GHz, with a quality factor value of 1.85 across 1.9 GHz, 3.3 across 3.3 GHz and 5.1 across 5.1 GHz. The metamaterial analysis was carried out using ANSYS ELECTRONIC DESKTOP. The proposed filter measures 20 × 18 × 1.6 mm3, which is significantly smaller than current filters. The designed bandpass filter occupies 50% of the space of a conventional filter. The designed bandpass filter exhibits a distributed surface current of 84 A/m, and 94 A/m across the wide- and narrow-band operating frequency. The simulated and measured results indicate that the suggested metamaterial filter is well-suited for multiband wireless applications like GPS (1.57 GHz), WLAN (2.4, 3.6, and 5.2 GHz), Wi-MAX (2.3, 2.5, and 3.5 GHz), and ISM (2.5 GHz).

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“…Generally, a filter is a linear physical system considered a two-port quadrupole. This system performs a signal processing operation to eliminate unwanted frequencies and let through useful ones [3]. Typically, microwave bandpass filters are used in the telecommunications field to select a suitable frequency band while attenuating all unwanted frequencies.…”

Section: Introductionmentioning

confidence: 99%

Highly selective dual-band interdigital bandpass filter for C-band applications

El Ouadi,

Khabba,

Amadid

et al. 2023

TELKOMNIKA

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Miniaturization in the telecommunications field is deemed a current challenge and a critical demand in order to improve communication quality between the transmitter and the receiver while avoiding clutter issues. The main objective of this work is to design a miniature interdigital bandpass filter (IBF) using planar technology. The proposed bandpass filter is made up of three equidistant parallel-coupled lines carefully deposited on a small Rogers-5880 substrate possessing a full dimension of 10×10×1.6 mm 3 , a relative permittivity 𝜀 𝑟 =2.2, and a loss tangen of 0.0009. The proposed IBF has been designed and simulated using the HFSS software, which is a simulator that studies the electromagnetic behavior of radio frequency structures using cutting-edge finite element solvers. The reached outcomes present good electrical performance in terms of insertion loss 𝑆 21 , reflection coefficient 𝑆 11 , voltage standing wave ratio (VSWR), and selectivity, making the proposed IBF suitable for integration in small electronic devices for C-band applications (4 GHz to 8 GHz).

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A review on microwave band pass filters: Materials and design optimization techniques for wireless communication systems

Cited by 28 publications

References 190 publications

Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology

Advanced Thermal Control Using Chip Cooling Laminate Chip (CCLC) with Finite Element Method for System-in-Package (SiP) Technology

Development of Compact Bandpass Filter Using Symmetrical Metamaterial Structures for GPS, ISM, Wi-MAX, and WLAN Applications

Highly selective dual-band interdigital bandpass filter for C-band applications

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