A review on the mechanisms of ultrasonic wedge-wedge bonding

Long, Yangyang; Twiefel, Jens; Wallaschek, Jörg

doi:10.1016/j.jmatprotec.2017.02.012

Cited by 48 publications

(9 citation statements)

References 80 publications

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“…The macro folding was primarily produced parallel to the direction of ultrasonic vibration. Even after the macro folding was complete, the apparent contact area had multiple small voids (or gaps) [16]. As illustrated in Figure 13b, blackish gray area were island streaks.…”

Section: Discussionmentioning

confidence: 99%

“…Furthermore, fundamental studies of adhesion would be necessary to understand the adhering processes [40][41][42]48,49]. Multiple problems remain which are yet to be solved for full comprehension of the adhesion behaviors [1,16,50].…”

Section: Discussionmentioning

confidence: 99%

“…Al ribbon bonding is applied to power electronics packaging as well as to Al wire bonding [1,[6][7][8]. Various studies of solid state ultrasonic microjoining have been reported [1,[7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25]. The dominant mechanism consists of friction slip, plastic deformation, frictional heating and interfacial reaction (interdiffusion) [9][10][11][12][13][14]22].…”

Section: Introductionmentioning

confidence: 99%

“…The dominant mechanism consists of friction slip, plastic deformation, frictional heating and interfacial reaction (interdiffusion) [9][10][11][12][13][14]22]. These mechanism elements influence each other; additionally, their contributions are changed by the bonding conditions (bonding force, F b , and ultrasonic power, P u ) [1,3,[9][10][11][12][13][16][17][18]. Frictional heating can soften materials when microjoining; however, the softening effect cannot be attributed to frictional heating alone [13,21].…”

Section: Introductionmentioning

confidence: 99%

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In-Situ Observation of Adhesion Behavior During Ultrasonic Al Ribbon Bonding

et al. 2019

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In-situ observation was performed on a transparent silica substrate during ultrasonic Al ribbon bonding, using a high-speed video camera with differing frame rates, 10 4 fps and 10 3 fps, to clarify the adhesion behavior. The bonding process was observed as follows. Initially, friction slip occurred, producing multiple island streaks in the direction parallel to the ultrasonic vibration. The island streaks were formed as a scratch, due to surface waviness of the Al ribbon. Momentarily, a belt-shaped bond zone was formed at the center, normally due to the ultrasonic vibration. The island streaks could be clearly observed at 10 4 fps. However, the central belt zone was unclear and appeared translucent at 10 4 fps; although it was clear when observed at 10 3 fps. The island streaks were unclear at 10 3 fps. The positional relation of the island streaks and the central belt zone was confirmed from in-situ observation results of a twist and peel test of Al ribbon bonded to silica substrate. The central belt zone was between the island streaks and the silica substrate.

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Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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In-Situ Observation of Adhesion Behavior During Ultrasonic Al Ribbon Bonding

et al. 2019

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“…Currently, wire bonding is the most popular first-level interconnection technology used between the die and package terminals. [1] It has been widely used as an interconnection technique in the electronic packaging industry since it was invented in the 1960s. [2] Approximately 9 trillion wires in electronic devices were bonded globally by this technique in 2008.…”

Section: Introductionmentioning

confidence: 99%

Mechanism of microweld formation and breakage during Cu–Cu wire bonding investigated by molecular dynamics simulation

Gu¹,

Shen²,

Li³

2022

Chinese Phys. B

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Currently, wire bonding is the most popular first-level interconnection technology used between the die and package terminals, but even with its long-term and excessive usage, the mechanism of wire bonding has not been completely evaluated. Therefore, fundamental research is still needed. In this study, the mechanism of microweld formation and breakage during Cu–Cu wire bonding was investigated by using molecular dynamics simulation. The contact model for the nanoindentation process between the wire and substrate was developed to simulate the contact process of the Cu wire and Cu substrate. Elastic contact and plastic instability were investigated through the loading and unloading processes. Moreover,the evolution of the indentation morphology and distributions of the atomic stress were also investigated. It was shown that the loading and unloading curves do not coincide, and the unloading curve exhibited hysteresis. For the substrate, in the loading process, the main force changed from attractive to repulsive. The maximum von Mises stress increased and shifted from the center toward the edge of the contact area. During the unloading process, the main force changed from repulsive to attractive. The Mises stress reduced first and then increased. Stress concentration occurs around dislocations inthe middle area of the Cu wire.

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Effect of process parameter characteristics on joint strength during ultrasonic metal welding of electrical contacts

2019

Weld World

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A review on the mechanisms of ultrasonic wedge-wedge bonding

Cited by 48 publications

References 80 publications

In-Situ Observation of Adhesion Behavior During Ultrasonic Al Ribbon Bonding

In-Situ Observation of Adhesion Behavior During Ultrasonic Al Ribbon Bonding

Mechanism of microweld formation and breakage during Cu–Cu wire bonding investigated by molecular dynamics simulation

Effect of process parameter characteristics on joint strength during ultrasonic metal welding of electrical contacts

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