2015
DOI: 10.1039/c5tc01556a
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A route to low temperature growth of single crystal GaN on sapphire

Abstract: Gallium nitride (GaN) was deposited on sapphire at 275 °C, using plasma-enhanced atomic layer deposition. The films are single-crystal for the first ∼5 nm, before they transition to a polycrystalline structure. These structural shifts are reflected in the variations of the refractive index.

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Cited by 45 publications
(45 citation statements)
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“…High temperatures of 800-1000 o C were traditionally and are currently used for GaN growth in both MBE and MOCVD to mitigate the energy barriers to precursor adsorption and surface adatom migration [56]. Such high growth temperatures, however, prevent the incorporation of substantial amounts of highly mismatched isovalent elements in the crystal lattice of GaN.…”
Section: Low Temperature Mbementioning
confidence: 99%
“…High temperatures of 800-1000 o C were traditionally and are currently used for GaN growth in both MBE and MOCVD to mitigate the energy barriers to precursor adsorption and surface adatom migration [56]. Such high growth temperatures, however, prevent the incorporation of substantial amounts of highly mismatched isovalent elements in the crystal lattice of GaN.…”
Section: Low Temperature Mbementioning
confidence: 99%
“…Earlier, followed by the synthesis of single-walled nanotubes and thick-wall tubular forms of GaN and AlN, [38][39][40] ultrathin GaN and AlN layer(s), or nanosheets, as well as their composites' several forms were grown on specific substrates such as sapphire, Si (111), 6H-SiC(0001), InGaN, single-walled carbon nanotube/graphene, etc. [41][42][43][44][45][46] Regarding the synthesis of the aforementioned h-AlN, Tsipas et al 47 have demonstrated the epitaxial growth of ultrathin hexagonal form of AlN on single crystal Ag (111) in 2013. They prepared AlN films by plasma assisted molecular beam epitaxy on Ag (111) substrate of single crystals [see Fig.…”
mentioning
confidence: 99%
“…11 There are only a few recent reports on the growth of GaN films using atomic layer deposition at low temperatures (<300 C) with improved crystalline quality and electrical properties. 6,12,13 In these reports, PA-ALD of GaN using trimethylgallium, 12 triethylgallium (TEG), 6,13 and N 2 /H 2 plasma as the precursors were reported at relatively low substrate temperatures. However, yet there is no report on the effect of the substrate temperature on the structural and optical properties of GaN films grown by using hollow-cathode plasma-assisted atomic layer deposition (HCPA-ALD).…”
Section: Introductionmentioning
confidence: 99%
“…1,2 Although high-quality GaN films grown by metal-organic chemical vapor deposition 3,4 and molecular beam epitaxy 5 at high growth temperatures (>800 C), which is necessary to increase the cracking efficiency of ammonia (NH 3 ) and mobility of precursor species at the substrate surface, 6 high growth temperatures limit the integration of GaN-based optoelectronic devices with Si CMOS technology as well as not being suitable for deposition of GaN on flexible polymeric substrates. Moreover, the integration of narrow band gap (In-rich) with wide band gap (Ga-rich) III-nitride layers is not possible due to the low vapor pressure and disassociation temperature of InN.…”
Section: Introductionmentioning
confidence: 99%