“…Operations Main Characteristics Objectives Approach/Result [34] burn-in oven p-batch, π , B πΆ WRB, CACB, π(π ) [36] burn-in oven p-batch, π , B πΆ WRB, decomposition-based MILP heuristics [37] cleaning p-batch, 2D packing, π , B πΆ MILP, constructive heuristics, BRKGA, HBL [38] burn-in oven p-batch, π , B βπΆ MILP, HMMAS, π(π‘ max π π ) [40] burn-in oven p-batch, π , π , B πΆ ACO, DP [41] burn-in oven p-batch, π , π , B πΆ MILP, WIS, FFWIS-ERT, ACO [42] burn-in oven p-batch, π , π , B πΆ job distances, FRS, MDS, UD [43] burn Appendix B GRASP-based dispatching rules [175] photolitho-graphy r j , M j , aux machine utilization, on-time delivery dedication load-based dispatching rules [176] wafer fabrication p-batch, recrc wafer movement, utilization, throughput closed-loop control based on load balancing [177] wafer fabrication hot jobs, p-batch WIP, bottleneck utilization ADR, BPNN, PSO [178] wafer fabrication hot jobs, p-batch WIP movement ADR, linear regression, GA [179] wafer fabrication p-batch, aux, recrc throughput, TSC dispatching rules [180] wafer fabrication r j , s lk , etc.…”